Renesas Technology’s Latest Integrated Driver-MOSFET Achieves Industry's Best Power Supply Efficiency — 96.5 Percent — and Has a 6x6mm Package for Intel® DrMOS Standard Products

About Renesas Technology Corp.

Renesas Technology Corp. is one of the world's leading semiconductor system solutions providers for mobile, automotive and PC/AV (Audio Visual) markets and the world's No. 1 supplier of microcontrollers. It is also a leading provider of LCD Driver ICs, Smart Card microcontrollers, RF-ICs, High Power Amplifiers, Mixed Signal ICs, System-on-Chip (SoC) devices, System-in-Package (SiP) products and more. Established in 2003 as a joint venture between Hitachi, Ltd. (TOKYO:6501) (NYSE:HIT) and Mitsubishi Electric Corporation (TOKYO:6503), Renesas Technology achieved consolidated revenue of 951 billion JPY in FY2007 (end of March 2008). Renesas Technology is based in Tokyo, Japan and has a global network of manufacturing, design and sales operations in around 20 countries with about 26,800 employees worldwide. For further information, please visit http://www.renesas.com.

Notes

*"Integrated Driver-MOSFET (DrMOS)" is a package standard proposed by Intel Corporation that features integration of a driver IC and two high-side/low-side MOSFETs.
Intel and the Intel logo are trademarks of Intel Corporation in the United States and other countries.
Other product names, company names or brands mentioned are the property of their respective owners.
 

Specifications:

 

Renesas Technology R2J20651NP High-efficiency Integrated-Driver MOSFET for DC/DC Power Supplies in PCs, Servers, Consumer Electronic Products, Etc.

Item   Specifications
Product name   R2J20651NP
Input voltage   4.5V to 16V
Output voltage   0.8V to 5.0V
Maximum rated current   35A
Maximum operating frequency   2MHz
Maximum power supply efficiency   96.5% at Vin = 5V, Vout = 1.8V, fsw = 200kHz
Configuration   High-side MOSFET, Low-side MOSFET, Driver IC
Package   40-pin QFN (6mm x 6mm x 0.95mm, 0.5mm lead pitch)



Featured Video
Latest Blog Posts
Sanjay GangalIndustry Predictions
by Sanjay Gangal
AECCafe Industry Predictions for 2025 – DGG
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Geoprocessing Product Engineer II for ESRI at Redlands, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025
SIGGRAPH 2025 at Convention Centre Vancouver, British Columbia Canada - Aug 10 - 14, 2025



© 2025 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise