Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition

Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

-- Other names and brands may be claimed as the property of others.



Contact:

Intel Corporation
Kari Aakre, 503-264-1607
Email Contact
or
Samsung Electronics
Sunghae Park, +82-31-209-7037
Email Contact
or
TSMC
Michael Kramer, +886-3-666-6216
Email Contact



« Previous Page 1 | 2             
Featured Video
Latest Blog Posts
Sanjay GangalIndustry Predictions
by Sanjay Gangal
AECCafe Industry Predictions for 2025 – DGG
Jobs
Senior Principal Software Engineer for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Upcoming Events
Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025
SIGGRAPH 2025 at Convention Centre Vancouver, British Columbia Canada - Aug 10 - 14, 2025



© 2025 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise