The International Compact Modeling Conference Announces Call for Papers on Device Modeling

 

SAN FRANCISCO, CALIFORNIA, USA- December 12, 2024 - The International Compact Modeling Conference (ICMC) is now accepting submissions for oral and poster presentations, inviting researchers and practitioners to advance the field of device modeling. Topics of interest include:

 

Submit a 2-page abstract by January 15, 2025.

For more information and to submit your research, visit https://2025.si2-icmc.org/.

 

 

The International Compact Modeling Conference is a new annual conference co-sponsored by the Silicon Integration Initiative Inc. (Si2), the Institute of Electrical and Electronics Engineers (IEEE), and the IEEE Electron Devices Society (EDS). Learn more at https://2025.si2-icmc.org/.

 

The Silicon Integration Initiative Inc. is a not-for-profit, research, and development joint venture that (Si2) was founded in 1988 as the CAD Framework Initiative (CFI). Learn more at  https://si2.org/.

 

IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Learn more at  https://www.ieee.org/.

 

EDS fosters the professional growth of its members by satisfying their needs for easy access to and exchange of technical information, publishing, education, and technical recognition and enhancing public visibility in the field of Electron Devices. Learn more at  https://eds.ieee.org/.

 

Laura LeBlanc

Conference Catalysts

icmc@conferencecatalysts.com

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