The RFP seeks proposals targeting FHE advances in the following areas:

• Development of Novel Materials, Additive Processing, and Printed Electronics for Harsh Environments
• Advancement in High-Density, Multi-Layer Interconnect Technology for Ultra-Narrow Linewidth and Spacing, FHE and Hybrid Electronics Packaging
• Advanced Design and Modeling Tools for FHE
• FHE Manufacturing, Standards, and Reliability
• Other (Restricted Open Topics)
  • Sensing
  • AI/ML Applications
  • Thermal Management

Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths including team diversity. See the SEMI FlexTech 2024 Request for Proposals for more details on the evaluation process.

White Paper Submissions

White paper submissions, the first step in responding to the RFP, are due July 21, 2024. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:

• Rationale
• Budget
• Collaboration value
• Dual-use (industry and military) applicability
• Relevance to the FHE ecosystem
• Schedules and milestones
• Reasonable and stretch deliverables
• Overall proposal quality

Request for Proposals Webinar

To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on June 24, 2024, at 10:00am PDT. A recording will be available for registrants unable to attend the event. Register for the webinar.

About FlexTech RFPs

FlexTech RFPs support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals.

The community encourages partnerships among industrial companies, R&D organizations, and university teams. Development partners retain ownership of intellectual property developed under FlexTech contracts.

FLEX Conference

The FHE community, including companies, universities, and U.S. government representatives, will again gather at the FLEX Conference, co-located with SEMICON West 2024, July 9-11, 2024, at the Moscone Center in San Francisco. Register for both events. 

The FLEX Conference will also provide opportunities for attendees to network and engage with representatives from the FlexTech, NBMC, and NextFlex federal funding programs.

About FlexTech
FlexTech is an industry-led public/private partnership that brings together scientists, engineers, and business development professionals from industry, government, and universities to collaboratively initiate research and the development of the infrastructure required to develop world-class FHE devices and products. Learn more.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org, contact a regional office, and connect with SEMI on  LinkedIn and  X to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email:  Email Contact