Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications
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Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications

LISLE, Ill., May 23, 2023 — (PRNewswire) — Molex, a global electronics leader and connectivity innovator, has introduced the industry's first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at speeds up to 224 Gbps-PAM4. As a result, Molex is uniquely positioned to meet heightened demands for the fastest available data rates powering advanced technology including generative AI, machine learning (ML), 1.6T networking and other high-speed applications.   

"Molex is collaborating closely with major technology innovators, as well as key data center and enterprise customers, to set an aggressive pace for 224G product introductions," said Jairo Guerrero, VP & GM, Copper Solutions, at Molex. "Our transparent, co-development approach facilitates early engagement with stakeholders across the 224G ecosystem to identify and resolve potential performance bottlenecks and design challenges, ranging from signal integrity and EMI reduction to the need for more efficient thermal management."

Connectivity Innovations Empower the 224G Ecosystem
Entirely new system architectures with multiple chip-to-chip connection schemes will be required to achieve data rates up to 224 Gbps-PAM4, which represents an important yet complex technology inflection point. To that end, a cross-functional, global team of Molex engineers collaborated closely with customers, technology leaders and suppliers, using the latest predictive analytics and advanced software simulations, to speed the design and development of a full portfolio of best-in-class solutions, including:

Product Availability
Samples of Mirror Mezz Enhanced, Inception and CX2 Dual Speed will be available this summer, with product samples of Molex's new OSFP and QSFP offerings slated for release in the fall.

About Molex
Molex is a global electronics leader committed to making the world a better, more-connected placeWith a presence in more than 40 countries, Molex enables transformative technology innovation in the automotive, data center, industrial automation, healthcare, 5G, cloud and consumer device industries. Through trusted customer and industry relationships, unrivaled engineering expertise, and product quality and reliability, Molex realizes the infinite potential of Creating Connections for Life. For more information, visit www.molex.com.

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SOURCE Molex Incorporated

Contact:
Company Name: Molex Incorporated
Media Contact: Sue Hetzel/HetzelMeade Communications, on behalf of Molex
Email Contact 760.473.4729