Toshiba Adds Five New MOSFET Gate Driver ICs that Will Help Reduce Device Footprints

- TCK42xG Series supports external back-to-back MOSFETs -

KAWASAKI, Japan — (BUSINESS WIRE) — May 30, 2022Toshiba Electronic Devices & Storage Corporation ("Toshiba") has added five products to its lineup of MOSFET gate driver ICs in the TCK42xG Series for mobile devices such as wearables. The new products in the series are equipped with an overvoltage lockout function and control the gate voltage of an external MOSFET according to the input voltage.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220530005063/en/

Toshiba: new MOSFET gate driver ICs "TCK42xG Series" that will help to reduce device footprints. (Graphic: Business Wire)

Toshiba: new MOSFET gate driver ICs "TCK42xG Series" that will help to reduce device footprints. (Graphic: Business Wire)

The new products are: “ TCK420G” for 24V power lines; “ TCK422G” and “ TCK423G” for 12V power lines; “ TCK424G” for 9V power lines; and “ TCK425G” for 5V power lines. Along with the already launched “ TCK421G” for 20V power lines, they are available now.

With this addition, TCK42xG series now allow users to select a gate-source voltage from two types, 10V and 5.6V, offering coverage of more MOSFETs. In addition, the lineup of the different detection voltages for the input overvoltage lockout function allows the products to be used for power lines from 5V to 24V. When combined with an external back-to-back MOSFET, they are also suitable for configuring a load switch circuit (Fig.1) or a power multiplexer circuit (Fig.2) with a reverse current blocking function. Furthermore, with their built-in charge pump circuit supporting a wide range of input voltages, from 2.7V to 28V, they provide stable voltage between the gate and source of an external back-to-back MOSFET with intermittent operation. This allows large currents to be switched.

Housed in a WCSP6G[1] package, one of the smallest in the industry[2], the TCK42xG series realizes high density mounting for small devices, such as wearables and smartphones, helping to reduce their footprint.

Toshiba has also developed “ Power multiplexer circuit” Reference Design, a reference design example for a power multiplexer that utilizes the functions of TCK42xG. It is available on Toshiba’s website from today.

Notes :
[1] A 1.2mm x 0.8mm chip scale package
[2] Among MOSFET gate driver ICs, Toshiba survey as of June 2022.

Applications

  • Wearables
  • Smartphones
  • Notebook PC, tablets
  • Storage equipment, etc.

Features

  • Gate-source voltage setting (5.6V, 10V) depending on input voltage with a built-in charge pump circuit
  • Over voltage lock out supports 5V to 24V
  • Low input OFF current: IQ (OFF) = 0.5μA (max) @VIN=5V

Main Specifications

 

(Unless otherwise specified, T a=25°C)

Part number

TCK420G

TCK421G

[3]

TCK422G

TCK423G

TCK424G

TCK425G

Package

Name

WCSP6G

Size (mm)

1.2×0.8 (typ.), t=0.35 (max)

Operating

ranges

Input operation voltage

VIN_opr (V)

@Ta= -40

to 85°C

2.7 - 28

Electrical characteristics

VIN UVLO threshold, VOUT falling

VIN_UVLO

typ./max (V)

@Ta= -40

to 85°C

2.0/2.5

VIN OVLO threshold,

VOUT falling

VIN_OVLO

min/max (V)

@Ta= -40

to 85°C

26.50

/28.50

22.34

/24.05

13.61

/14.91

10.35

/11.47

5.76

/6.87

Standby current

(OFF state)

IQ(OFF) max (μA)

@VIN=5V, Ta= -40

to 85°C

0.5

GATE Drive voltage

(V GATE1 -V IN )

(V GATE2 -V OUT )

V GS typ. (V)

@V IN =

12V/20V

10/10

10/10

10/-

5.6/-

-/-

-/-

GATE Drive voltage

(V GATE1 -V IN )

(V GATE2 -V OUT )

V GS typ. (V)

@V IN =

5V/9V

10/10

10/10

10/10

5.6/5.6

5.6/5.6

5.6/-

V GS ON time

t ON typ. (ms)

@V IN =5V,

C GATE1,2 =

4000pF

2.9

V GS OFF time

t OFF typ. (μs)

@V IN =5V,

C GATE1,2 =

4000pF

52

23

OVLO

V GS turn OFF time

t OVP typ. (μs)

@C GATE1,2 =

4000pF

31

34

41

16

18

19

Sample Check & Availability

Buy Online

Buy Online

Buy Online

Buy Online

Buy Online

Buy Online


1 | 2  Next Page »
Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Equipment Engineer, Raxium for Google at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise