• Watch the AMD EPYC 7003 Series keynote
• Visit the AMD EPYC 7003 Series Processor Launch Page
• Learn more about the AMD EPYC 7003 Series Processors
• Read more about the ecosystem partners supporting AMD EPYC™
• Follow AMD on Twitter

About AMD
For more than 50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies â�• the building blocks for gaming, immersive platforms and the data center. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world are focused on building great products that push the boundaries of what is possible. For more information about how AMD is enabling today and inspiring tomorrow, visit the AMD (NASDAQ: AMD)  website,  blog,  Facebook and Twitter pages.

CAUTIONARY STATEMENT
This press release contains forward-looking statements concerning Advanced Micro Devices, Inc. (AMD) such as the features, functionality, performance, availability, timing and expected benefits of AMD products including the AMD EPYC™ 7003 Series processors and expected ecosystem partners and products, which are made pursuant to the Safe Harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as "would," "may," "expects," "believes," "plans," "intends," "projects" and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this press release are based on current beliefs, assumptions and expectations, speak only as of the date of this press release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Such statements are subject to certain known and unknown risks and uncertainties, many of which are difficult to predict and generally beyond AMD's control, that could cause actual results and other future events to differ materially from those expressed in, or implied or projected by, the forward-looking information and statements. Material factors that could cause actual results to differ materially from current expectations include, without limitation, the following: Intel Corporation’s dominance of the microprocessor market and its aggressive business practices; global economic uncertainty; the loss of a significant customer; the impact of the COVID-19 pandemic on AMD’s business, financial condition and results of operations; the competitive markets in which AMD’s products are sold; quarterly and seasonal sales patterns; market conditions of the industries in which AMD products are sold; the cyclical nature of the semiconductor industry; AMD's ability to adequately protect its technology or other intellectual property; unfavorable currency exchange rate fluctuations; the ability of third party manufacturers to manufacture AMD's products on a timely basis in sufficient quantities and using competitive technologies; expected manufacturing yields for AMD’s products; the availability of essential equipment, materials or manufacturing processes; AMD's ability to introduce products on a timely basis with features and performance levels that provide value to its customers; AMD's ability to generate revenue from its semi-custom SoC products; potential security vulnerabilities; potential IT outages, data loss, data breaches and cyber-attacks; uncertainties involving the ordering and shipment of AMD’s products; AMD’s reliance on third-party intellectual property to design and introduce new products in a timely manner; AMD's reliance on third-party companies for the design, manufacture and supply of motherboards, software and other computer platform components; AMD's reliance on Microsoft Corporation and other software vendors' support to design and develop software to run on AMD’s products; AMD’s reliance on third-party distributors and add-in-board partners; the impact of modification or interruption of AMD’s internal business processes and information systems; compatibility of AMD’s products with some or all industry-standard software and hardware; costs related to defective products; the efficiency of AMD's supply chain; AMD's ability to rely on third party supply-chain logistics functions; AMD’s ability to effectively control the sales of its products on the gray market; the impact of government actions and regulations such as export administration regulations, tariffs and trade protection measures; AMD’s ability to realize its deferred tax assets; potential tax liabilities; current and future claims and litigation; the impact of environmental laws, conflict minerals-related provisions and other laws or regulations; the impact of acquisitions, joint ventures and/or investments on AMD's business, including the announced acquisition of Xilinx, and the failure to integrate acquired businesses; AMD’s ability to complete the Xilinx merger; the impact of the announcement and pendency of the Xilinx merger on AMD’s business; the impact of any impairment of the combined company’s assets on the combined company’s financial position and results of operation; the restrictions imposed by agreements governing AMD’s notes and the revolving credit facility; the potential dilutive effect if the 2.125% Convertible Senior Notes due 2026 are converted; AMD's indebtedness; AMD's ability to generate sufficient cash to service its debt obligations or meet its working capital requirements; AMD's ability to repurchase its outstanding debt in the event of a change of control; AMD's ability to generate sufficient revenue and operating cash flow or obtain external financing for research and development or other strategic investments; political, legal, economic risks and natural disasters; future impairments of goodwill and technology license purchases; AMD’s ability to attract and retain qualified personnel; AMD’s stock price volatility; and worldwide political conditions. Investors are urged to review in detail the risks and uncertainties in AMD’s Securities and Exchange Commission filings, including but not limited to AMD’s most recent reports on Forms 10-K and 10-Q.

AMD, the AMD Arrow logo, EPYC, Instinct, and combinations thereof are trademarks of Advanced Micro Devices, Inc.
VMware and vSphere are registered trademarks or trademarks of VMware, Inc. in the United States and other jurisdictions.

*AMD EPYC 7763
**AMD EPYC 72F3

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1} MLN-057K: Based on SPECrate®2017_int_base on 02/20/2021, a server powered by two 8c AMD EPYC 72F3 CPU has a measured estimated score of 176 with a per core score of 11.00 which is a higher per core performance score than any currently posted in any SPEC.org publication. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
² MLN-016: Results as of 01/28/2021 using SPECrate®2017_int_base. The AMD EPYC 7763 a measured estimated score of 798 is higher than the current highest 2P server with an AMD EPYC 7H12 and a score of 717, https://spec.org/cpu2017/results/res2020q2/cpu2017-20200525-22554.pdf. OEM published score(s) for 3rd Gen EPYC may vary. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
³ MLN-003: Based on AMD internal testing as of 02/1/2021, average performance improvement at ISO-frequency on an AMD EPYC™ 72F3 (8C/8T, 3.7GHz) compared to an AMD EPYC™ 7F32 (8C/8T, 3.7GHz), per-core, single thread, using a select set of workloads including SPECrate®2017_int_base, SPECrate®2017_fp_base, and representative server workloads. SPEC® and SPECrate® are registered trademarks of Standard Performance Evaluation Corporation. Learn more at spec.org.
⁴ MLN-056: Each AMD EPYC 7003 processor has 8 memory channels. Each Intel Xeon Scalable processor has 6 memory channels. 8 – 6 = 2 ÷ 6 = 0.33 AMD EPYC has 33% more memory bandwidth. Class based on industry-standard pin-based (LGA) X86 processors.
⁵ MLN-055: AMD EPYC 7003 CPUs with PCIe4 lanes have 2X the I/O throughput capacity per lane than any Intel Xeon Scalable CPU which use PCIe3. PCIe4 provides 16GB/s of link bandwidth versus PCIe3 with 8Gb/s, https://pcisig.com/pci-express-delivering-needed-bandwidth-open-compute-project.
⁶MLN-074K: Based on SPECrate®2017_fp_base on 02/20/2021, a server powered by two 64c AMD EPYC 7763 CPUs has a score of 636 a compliant result run on an ThinkSystem SR665; with Memory: 512 GB (16 x 32 GB 2Rx4 PC4-3200AA-R); OS: Red Hat Enterprise Linux release 8.3 (Ootpa); Compiler: C/C++/Fortran: Version 3.0.0 of AOCC. Versus the current highest score Intel Cascade Lake Refresh server with a score of 309 with a 2P Intel Gold 6258R based server, https://spec.org/cpu2017/results/res2020q3/cpu2017-20200915-23979.pdf. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.
⁷ EPYC-10: AMD EPYC has up to 64c/128t and Intel Scalable has up to 56c/112t, per processor.
⁸ MLN-073K: Based on SPECrate®2017_int_base on 02/20/2021, a server powered by two 64c AMD EPYC 7763 CPUs has a score of 819 in a compliant result run on an ThinkSystem SR645; with Memory: 2 TB (32 x 64 GB 2Rx4 PC4-3200AA-R), OS: SUSE Linux Enterprise Server 12 SP5 (x86_64) Kernel 4.12.14-120-default; Compiler: C/C++/Fortran: Version 3.0.0 of AOCC. Versus the current highest score Intel Cascade Lake Refresh server with a score of 397 using 2P Intel Gold 6258R, https://spec.org/cpu2017/results/res2020q3/cpu2017-20200915-23981.pdf. SPEC®, SPECrate® and SPEC CPU® are registered trademarks of the Standard Performance Evaluation Corporation. See www.spec.org for more information.