Hologram AR Chip Will Become the Mainstream Technology in the Future

Alpha and Omega Semiconductor Announces a New High SOA MOSFET for 12V Hot Swap Applications

Analog Devices Reports Third Quarter Fiscal 2020 Results With Revenue and EPS Above the Midpoint of Guidance

CEVA's Wi-Fi 6 Solution Becomes World's First IP to Achieve Wi-Fi CERTIFIED 6™ Status from the Wi-Fi Alliance®

MobiusTrend: WIMI Enters Semiconductor Business with 3D Holographic Vision Chip Upgrading

SK hynix to Expand United States Market Presence with the Launch of the World's First 128-Layer NAND Consumer PCIe NVMe SSD

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

Bentley Systems by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

AECCafe Voice by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

Industry Predictions by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

Principal Engineer for Autodesk at San Francisco, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Senior Principal Software Engineer for Autodesk at San Francisco, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Engineer 2 for Lam Research at Fremont, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024

Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025

Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025

BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025