Toshiba Memory Corporation Launches e-MMC Ver. 5.1 Compliant Embedded Flash Memory Products Utilizing BiCS FLASHTM 3D Flash Memory

Notes
[1] One of the standard specifications of embedded flash memory defined by JEDEC. The new product also supports the command queuing and secure write protection functions which is specified as an option in JEDEC e-MMC Ver. 5.1.
[2] Product density is identified based on the density of memory chip(s) within the Product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary based on the host device and application. For details, please refer to applicable product specifications.

* Company names, product names, and service names mentioned herein may be trademarks of their respective companies.

Customer Inquiries:
Toshiba Memory Corporation
Sales Planning Division
Tel: +81-3-6478-2423
https://business.toshiba-memory.com/en-jp/contact.html

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.



Contact:

Media Inquiries:
Toshiba Memory Corporation
Sales Strategic Planning Division
Koji Takahata
Tel: +81-3-6478-2404



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