Media Alert: Rambus to Showcase High-performance SerDes Solutions at the eSilicon Live Seminars in Tokyo and Shanghai

Join Rambus at the live seminars titled, “ A Complete 14nm 2.4D, HBM2, SerDes ASIC Solution” that discusses solutions for delivering 2.5D systems to support the development of applications in the high-performance computing, networking, deep learning and 5G markets. The live seminars will be held in both Tokyo and Shanghai.

Speaker Details

  • Hear Chikara Hoshino, Senior Manager of Technical Marketing of Rambus Memory and Interfaces Division, discuss, “High-performance SerDes,” on Monday, December 11, 2017 at the Tokyo Conference Center Shinagawa from 10:30-15:30 local time.
  • Listen to Mohit Gupta, Senior Product Marketing Manager of Rambus Memory and Interfaces Division, discuss, “High-performance SerDes,” on Thursday, December 14, 2017 at the Kerry Hotel Pudong in Shanghai from 10:30-15:30 local time.

For more information, visit https://www.rambus.com/events.

Follow Rambus:

Company website:  rambus.com
Rambus blog:  rambus.com/blog
Twitter:  @rambusinc
LinkedIn:  www.linkedin.com/company/rambus
Facebook:  www.facebook.com/RambusInc

About Rambus Memory and Interfaces Division

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the communications and data center computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and SerDes interfaces, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security, and emerging technologies to positively impact the modern world. We collaborate with the industry, partnering with leading chip and system designers, foundries, and service providers. Integrated into tens of billions of devices and systems, our products power and secure diverse applications, including Big Data, Internet of Things (IoT) security, mobile payments, and smart ticketing. For more information, visit rambus.com.

Source: Rambus Inc.



Contact:

SHIFT Communications
Leslie Clavin, 415-591-8440
Email Contact
or
Rambus Corporate Communications
Cori Pasinetti, 408-462-8306
Email Contact



« Previous Page 1 | 2             
Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise