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Leti Demonstrates World's First 300-mm Wafer-to-Wafer Direct Hybrid Bonding with 1-Micron Pitch on EV Group System
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The GEMINI®FB XT automated production fusion bonding system from EV Group is optimized for ultra-high throughput and productivity. The SmartView®NT aligner integrated into the system provides industry-leading wafer-to-wafer overlay alignment accuracy (sub-200nm, 3-sigma). Photo courtesy of EVG.

View original content with multimedia: http://www.prnewswire.com/news-releases/leti-demonstrates-worlds-first-300-mm-wafer-to-wafer-direct-hybrid-bonding-with-1-micron-pitch-on-ev-group-system-300554711.html

SOURCE EV Group

Contact:
EV Group
Leti
Nanoelec Research Technological Institute
Web: http://www.evgroup.com



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