1. Integrated NAND Flash Memory Management
The
JEDEC e∙MMC Version 5.1 compliant interface handles essential
functions, including writing block management, error correction and
driver software. It simplifies system development, allowing
manufacturers to minimize development costs and speed up time to market
for new and upgraded products. Additionally, new features[5]
standardized in JEDEC e∙MMC Version 5.1, such as BKOPS control,
Cache Barrier, Cache Flushing Report, Large RPMB Write and Command
Queuing, are applied to the new products to enhance usability.
2. Extended Temperature Range
Supports
operating temperature range of -40°C to +105°C.
Toshiba also
conducted additional reliability test to meet AEC-Q100 Grade2
specifications.
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Key Specifications |
||
| Interface |
JEDEC e∙MMC V5.1 standard
HS-MMC interface |
|
| Capacity | 8GB, 16GB, 32GB, 64GB | |
| Power Supply Voltage |
2.7-3.6V (Memory core)
1.7V-1.95V, 2.7V-3.6V (Interface) |
|
| Bus Width | x1, x4, x8 | |
| Temperature Range | -40oC to +105oC | |
| Package |
153Ball FBGA
11.5mm x 13.0mm |
|
|
Notes |
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| [1] | e•MMCTM is a product category for a class of embedded memory products built to the JEDEC e•MMC Standard specification and is a trademark of the JEDEC Solid State Technology Association. | |
| [2] | Electrical component qualification requirements defined by the AEC (Automotive Electronics Council). | |
| [3] | Advanced Driving Assistant System | |
| [4] | Universal Flash Storage: Product category for a class of embedded memory products built to the JEDEC Standard specification. | |
| [5] |
“BKOPS control” is a function where the host allows the device to perform background operation when the device is idle. “Cache Barrier” is a function that controls when cache data is written to the memory chip. “Cache Flushing Report” is a function that informs the host if the device’s flushing policy is FIFO (First In First Out) or not. “Large RPMB write” is a function that increases the data size that can be written to the RPMB area to 8KB. |
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