OTTAWA, ON and SANTA CLARA, CA--(Marketwired - September 12, 2016) -

What
Sidense exhibiting at the TSMC OIP Ecosystem Forum

Where
San Jose Convention Center
150 W. San Carlos St.
San Jose, CA 95113
Booth #301

When
Thursday, September 22
8:00AM to 6:30PM

What
In Booth #301, Sidense will discuss how its 1T-OTP non-volatile memory (NVM) IP is well suited for many Smart Connected Universe applications, focusing on the fast-growing automotive and mobile communication markets. The Smart Connected Universe describes a collection of market segments that are both Smart (have computational capability) and are Connected (usually in a wireless network). These segments share a common set of requirements in cost, power, performance and security. Meet with our knowledgeable and friendly people to learn how your Mobile Computing, Automotive, IoT, Wearables, Medical and Industrial designs can benefit from Sidense 1T-OTP.

About Sidense
Sidense Corp. provides very dense, highly reliable and secure non-volatile one-time programmable (OTP) Logic Non-Volatile Memory (LNVM) IP for use in standard-logic CMOS processes. The Company, with over 120 patents granted or pending, licenses OTP memory IP based on its innovative one-transistor 1T-Fuse™ bit cell, which does not require extra masks or process steps to manufacture. Sidense 1T-OTP macros provide a better field-programmable, reliable and cost-effective solution than flash, mask ROM, eFuse and other embedded and off-chip NVM technologies for many code storage, encryption key, analog trimming and device configuration uses.

Over 150 companies, including many of the top fabless semiconductor manufacturers and IDMs, have adopted Sidense 1T-OTP as their NVM solution for more than 500 designs. Customers are realizing outstanding savings in solution cost and power consumption along with better security and reliability for applications ranging from mobile and consumer devices to high-temperature, high-reliability automotive and industrial electronics. The IP is offered at and supported by all top-tier semiconductor foundries and selected IDMs. Sidense is headquartered in Ottawa, Canada with sales offices worldwide. For more information, please visit www.sidense.com.

About the TSMC OIP Ecosystem Forum
The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem companies and our customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event.

At this year's Forum you will hear directly from TSMC OIP companies about how to apply their technologies to address your design challenges. This year, the Forum is a day-long conference kicking-off with trend-setting addresses and announcements from TSMC and leading IC design company executives. The Ecosystem Pavilion features up to 60 member companies showcasing their products and services.

For more information or to schedule a meeting with Sidense, please contact:
Jim Lipman
Sidense Corp.

Email contact


925-606-1370