Short-pulse Signal Technology Enables 5μm Resolution Fault Isolation to Pinpoint and Map Circuit Defects
TOKYO — (BUSINESS WIRE) — October 22, 2015 — Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) announced today that it has initiated sales of its new TDR Option for the company’s TS9000 series of terahertz analysis systems. The new option enables analysis of circuit quality in semiconductors, printed substrates, electronic components, and other applications, utilizing short-pulse terahertz waves.
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Advantest will demonstrate its new TS9000 terahertz analysis systems for the semiconductor industry in booth 619, at the International Microelectronics Assembly and Packaging Society conference in Orlando, FL, October 27-29, 2015 at the Rosen Center Hotel. IMAPS is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies. More information on IMAPS can be found at: http://www.imaps.org/imaps2015/
Background
Electronic device circuit quality analysis is commonly performed using oscilloscope TDR (time domain reflectometry). However, as devices grow smaller and more highly integrated, the ability to locate failures with extreme spatial precision has become increasingly more important., Existing measurement instruments have limited resolution, as the rise time of the short pulse cannot be compressed much further, creating the risk that existing analysis technologies will be inadequate to handle the requirements of the highly integrated devices on the horizon. Advantest’s terahertz analysis technology addresses these concerns and meets the need for ultra-high-resolution measurement by utilizing short-pulse terahertz waves for analysis of complex electrical circuits.
Key Features
The TS9000 TDR Option relies on Advantest’s market-proven TDT/TDR* measurement technology to pinpoint and map circuit defects utilizing short-pulse signal processing. The solution delivers circuit analysis with an extremely high spatial precision of less than 5μm, and a maximum measurement range of 300 mm, including for internal circuitry used in through-silicon vias (TSVs) and interposers. Moreover, with the optional TDR/TDT CAD Data Link, errors located can be mapped and displayed on the CAD data of the target device, making it much easier for users to identify the causes of errors. Three types of TDR/TDT probes, each with a different resolution and measurement distance setting, are available for the TS9000 TDR Option, as are customizations for unique contact requirements.
Advantest announced the TS9000 MTA Option, a terahertz analysis system for measuring semiconductor mold thickness, in September 2014. With the launch of the TDR Option, the TS9000 Series continues to define the company’s new approach to measurement utilizing terahertz technology, adding critical support for advanced electronic device measurement and product quality management.
* TDR (time domain reflectometry)/TDT (time domain transmissometry) is widely used to locate circuit failures. Signals are output and the times taken for them to be reflected / transmitted through the target device, as well as their waveforms, form the basis of measurement calculations, allowing users to determine the transmissivity and other qualities of the device.
Key Specifications
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Maximum DUT size: |
150mm×150mm | |||
| Fault position locating resolution: | < 5 µm | |||
| Available measurement length: | > 300 mm (In TDR configuration) | |||
| > 600 mm (In TDT configuration) | ||||
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Measurement time: |
< 5 min/point @ TDR 300 mm | |||
| Size/Weight | Probe Station: | 1230mm(W) x 830mm(D) x 700mm(H) / 140kg or less | ||
| Analysis Unit: | 430mm(W) x 540mm(D) x 230mm(H) / 30kg or less | |||
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Optical Unit: |
430mm(W) x 240mm(D) x 220mm(H) / 14kg or less | ||
About Advantest Corporation
A world-class technology company, Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments used in the design and production of electronic instruments and systems. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies, and has introduced multi-vision metrology scanning electron microscopes essential to photomask manufacturing, as well as groundbreaking 3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has subsidiaries worldwide. More information is available at www.advantest.com.
All information supplied in this release is correct at the time of publication, but may be subject to change.
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Contact:
Advantest Corporation
Hiroki Yanagita, 088-3-3214-7500
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