( http://www.researchandmarkets.com/research/qn4qmb/surface_mount) has announced the addition of the "Surface Mount Technology (SMT) Equipment - Global Strategic Business Report" report to their offering.

The report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World.

Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs.

This report analyzes the worldwide markets for Surface Mount Technology (SMT) Equipment in US$ Thousands by the following Product Groups/Segments:

• Screen Print Equipment (Manual Screen Print Equipment
• Semiautomatic Screen Print Equipment, & Automatic Screen Print Equipment)
• Placement Equipment Market (High-Speed Placement Equipment, Medium Speed Placement Equipment, & Low-Speed Placement Equipment)
• Soldering Equipment (Reflow Oven, & Wave Oven)
• Cleaning Equipment
• Inspection Equipment (Optical Inspection Equipment, X-Ray Inspection Equipment, & Laser Inspection Equipment)
• Repair and Rework Equipment (Manual Repair and Rework Equipment, & Semiautomatic Repair and Rework Equipment)

The report profiles 63 companies including many key and niche players such as:

• ASM Assembly Systems GmbH & Co. KG (Germany)
• Assembléon Netherlands BV (The Netherlands)
• Conceptronic (US)
• CyberOptics Corporation (US)
• Electro Scientific Industries, Inc. (US)
• Fuji Machine Manufacturing Co., Ltd. (Japan)
• Glenbrook Technologies, Inc. (US)
• Heller Industries, Inc. (US)
• Juki Corporation (Japan)
• Kabushiki Kaisha Hitachi Seisakusho (Hitachi, Ltd) (Japan)
• Hitachi High Technologies Corporation (Japan)
• Koh Young Technology, Inc. (South Korea)
• Mycronic AB (Sweden)
• Nikon Metrology NV (Belgium)
• Nordson Corporation (US)
• Omron Corporation (Japan)
• Orbotech, Ltd. (Israel)
• Panasonic Corporation (Japan)
• Saki Corporation (Japan)
• Speedline Technologies Inc. (US)
• Teradyne, Inc. (US)
• Test Research, Inc (Taiwan)
• Universal Instruments Corporation (US)
• Viscom AG (Germany)
• YXLON International GmbH (Germany)

Key Topics Covered:

1. INDUSTRY OVERVIEW

• Surface Mount Technology - An Introductory Prelude
• Surface Mount Technology Equipment - Market Overview
• Opportunity Indicators
• Impact of 2007-2009 Economic Recession in Retrospect
• Market Recovers in 2010
• Market Turns Volatile Once Again Between 2011-2014
• Natural Disasters take a Toll on PCB Assemblies in 2011 & 2012 - Slows Down Growth Prospects for SMT Equipment
• Eurozone' Debt Crisis Drags SMT Equipment Market into the Red in 2012 & 2013
• US Too Sees Significant Erosion in Demand for SMT Equipment in 2012 & 2013
• Structural & Cyclical Downturn of Emerging Markets & Its Impact on the SMT Equipment Market During 2011-2013
• Resurgence in Growth Fundamentals Encourages an Optimistic Market Outlook for the Year 2014 & Beyond
• Steady Acceleration in Global PMI Benefits Augurs Well for the Market
• Outlook
• Asia-Pacific Continues to be Hotspot for Growth
• 'The Booming ECMS Sector to Boost Demand for SMT Equipment in Asia-Pacific
• Is China Loosing Sheen?
• Competitive Scenario
• Value Added Services Become Key Differentiator
• Towards Consolidated Endeavors

2. NOTEWORTHY TRENDS & GROWTH DRIVERS

• Need for Speed & Flexibility in Electronics Manufacturing Industry Spur Growth
• Next Generation Electronics: Opens up Opportunities for SMT
• Shrinking PCB Size Paints Brighter Prospects
• Placement Equipment - The Traditional Revenue Contributor
• Technological Innovations Set to Drive the Market in SMT Placement Equipment Market
• Machine Vision Gains Stronger Roots in SMT Placement Equipment Market
• Convergence Playing an Instrumental Role in Placement Equipment Market
• Screen Print Equipment - The Fastest Growing Product Segment
• Market Drivers and Restraints for Various Screen-Printers
• Jet Printing Competes Stencil Printing in Screen Printer Market
• SMT Screen Printer Equipment Vendors Go for Integrated Solutions
• SMT Inspection Equipment to Gain Traction in Coming Years as Manufacturers Shift Focus from Defect Detection to Defect Prevention
• Rising Adoption of Lead-Free Solder Strengthens Sales of Inspection Equipment
• Right Timing' Influence Sales Patterns for SMT Inspection Equipment
• Repair and Rework also Drives Demand for AXIs
• Technological Advancements Spearheading Market Prospects for SMT Inspection Equipment
• Growing Package Complexity Driving Business Case for Advanced Inspection Equipment
• Drifting from Manual to Sensor-based Inspection Systems
• 3D Inspection Solutions to Drive Growth
• Productivity Optimization Drive Opens New Ground for Next Generation AOIs
• AOI Segment Explores New Opportunities
• Second Generation AOI Control Solutions: Design is the Key for Success
• Advances in X-Ray Inspection Systems Drive Efficiency
• SMT Soldering Equipment Sees Strong Growth Prospects
• Trend-Setting Technologies
• Intensifying R&D to Foster Growth
• Lead-Free Solder: Emboldens Growth Opportunities
• Slow But Steady Growth Opportunities for SMT Cleaning Equipment
• Lead-Free Manufacturing Continues to Drive Demand
• Difficulties Faced in the Cleaning of Lead-free Equipment
• APT Drives the Market
• Impact of Government Regulations on SMT Cleaning Equipment
• Repair and Rework Emerge as an Integral Part of EMS - Drive Demand for SMT Repair & Rework Equipment
• Escalating Assembly Costs Drive Demand for Rework Equipment
• Growth in Electronic Manufacturing to Boost Market Prospects for SMT Equipment
• A Look into Key Electronic Device Markets Driving Demand for PCB Assemblies and Therefore Critical to SMT Equipment Demand
• Recovering Consumer Electronics Market to Spur Growth
• Growing Adoption of Electronics in Automobiles Signals Prospects
• Medical Device Industry Adds to the Demand for Advanced SMT Equipment
• Medical Device Miniaturization to Boost Demand
• Aerospace & Defense Sector - Add Another Dimension
• LED Components Market - A Business Case for SMT Equipment
• Demand for High-Mix' Equipment on Rise
• Manufacturers Go Green'
• Machine Vision: A Stitch in Time

3. CHALLENGES AND MARKET RESTRAINTS

• SMT - Not Completely Free of Defects
• Purchase Cycles Reward But Also Retard Growth
• Commoditization Kills Price Differentials
• Skewed Customer Profile Strains the Margins
• Used Equipment: The Threat is Real
• High Entry Barriers Hinder New Market Entrants
• Density Packing Voices Concerns for High Quality Placement and Inspection
• High False Calls and Escape Rates Dent Investor Confidence in SMT Inspection Equipment
• Multiple Technologies Cannibalize Sales for SMT Inspection Equipment
• Price Sensitivity: A Major Challenge for SMT Equipment
• Pricing Undercuts Market Leadership

4. THE TECH PRIMER

• Surface Mount Technology - A Curtain Raiser
• Electronics Packaging Technology Prior to SMT
• Packaging Without Holes
• What Drives SMT Market?
• Benefits of Surface Mounting
• Higher Functional Density and Spatial Utilization
• Substantial Reduction in Costs and Board Weights
• Superior Electrical Performance
• Shortened Time-to-Market
• Initial Glitches
• Type I, II and III Surface Mount Assemblies
• Types of Surface Mount Packages
• Small Outline Integrated Circuits (SOICs)
• Plastic Leaded or Leadless Chip Carriers (PLCCs and LCCs)
• Chip Scale Packages (CSPs)
• Ball Grid Arrays (BGAs)
• Micro Ball Grid Array (microBGAs)
• Fine Pitch Devices
• Surface Mounting - A Concise Overview of the Process
• Defects - Intimidating Challenges to the Board Quality and Performance
• Sources of Defects
• Description of Process Related Defects
• Cost of Defects
• Surface Mount Design - The First Step
• Designing Entails 80% of the Cost
• What are Land Patterns?
• Some Major Design Considerations
• Spatial Considerations
• Component Alignment Considerations
• Via Holes
• Number of Test Nodes
• Prototype Inspection
• Solder Paste Application/Paste Printing - The Blue Print
• Important Considerations for Good Quality Printing
• Why Use Solder Paste?
• Which Type of Solder Paste to be Used?
• Prerequisites of an Ideal Solder Paste
• Regulations on the Usage of Solder Pastes
• Component Placement - Mounting'
• Prerequisites for Precise Placement
• Soldering - Making the Electrical Connections
• Reflow Soldering
• Wave Soldering
• Classification of Solder Joints
• Good Solder Joint
• Poor Solder Fillet
• Shorts
• Cleaning - Wiping off the Contaminants
• Impact of Cleaning Processes on Component Choice
• Inspection - Locating the Defects
• Visual/Manual Inspection
• Optical/Laser Inspection
• X-Ray Inspection
• Repair and Rework - Setting the Defects Right
• Functional Testing - The Ultimate Step
• Emerging Technologies, Challenges and the Roadmap for the Future

5. PRODUCT OVERVIEW

• Classification of SMT Equipment
• Low-Range/Entry Level Machinery
• Mid-Range Machinery
• High-Range/High Level Machinery
• Used Equipment
• New Equipment
• SMT Screen Print Equipment
• Advantages of Screen Print Equipment
• Manual Screen Print Equipment
• Semiautomatic Screen Print Equipment
• Automatic Screen Print Equipment
• SMT Placement Equipment
• On Basis of Technology
• Gantry/Cartesian Robots
• Turret Placement Systems
• On Basis of Speed
• High Speed Placement Systems
• Medium Speed Placement Systems
• Low Speed Placement Systems
• SMT Soldering Equipment
• Reflow Ovens
• Design Considerations
• Wave Ovens
• SMT Cleaning Equipment
• Aqueous Cleaning Equipment
• Semi-Aqueous
• Solvent Cleaning Equipment
• Traditional Solvents: Tarnished by Environmental Impact
• Ultrasonic Cleaning Equipment
• SMT Inspection Equipment
• Optical Inspection Systems: Camera Eyes the SMT Lines
• Manual Inspection Systems
• Automated Optical Injection
• Automated Optical Inspection Systems
• Technological Drivers
• Increasing Circuit Complexity and Density
• Improvements in Key Technology Components of AOI Systems
• Miniaturization Drive
• Advantages of AOIs
• Optical Inspection Systems for Yield Management
• Post- Print-Paste Inspection Machines
• Post-Placement Inspection Machines
• Post-Reflow Inspection Machines
• Post Reflow or Post Placement?
• X-Ray Inspection Equipment: X-Ploring the Unseen
• Major Design Considerations for Enhanced Performance
• Focal Spot Size
• Tube Voltage
• Geometric Magnification
• Tube Lifetime
• Standalone or Inline..?
• Types of X-Ray Equipment
• Manual X-Ray Inspection Systems
• Semi Automated X-Ray Inspection Systems
• Automated X-Ray Inspection Systems
• How to Improve Functionality of AXIs?
• False Failures
• Escape Rates
• False Failure Rates and Escape Rates: Striking the Balance
• Benefits of AXIs
• 2 Dimensional X-Ray Systems
• 3 Dimensional X-Ray Systems
• The Choice of the Ideal System
• Laser Inspection Systems
• Prerequisites of Laser Beams for High Precision Inspection
• Emerging Trends in Inspection Systems
• Next Gen' Inspection Systems Team up' to Fix' the Problems
• SMT Repair and Rework Equipment
• Manual Rework and Repair Equipment
• Semi-Automatic Rework and Repair Equipment
• SMT Equipment Markets: A Historic Backdrop
• After All, It's the Testing Time'

6. END-USER PROFILE

• Important End Uses of Surface Mount Technology
• Telecommunications Soars Demand
• Healthcare Segment Reinforcing Growth in SMT Equipment Industry
• Enabling the Electronic Marvel
• From OEMs to CEMs and EMS Providers: Changing Customer Profile
• Electronic Manufacturing Services Industry: Bitten by Pricing Pressures

7. PRODUCT INNOVATIONS/INTRODUCTIONS/ IMPROVEMENTS

• Europlacer to Introduce New Line-Up of Products
• Speedline Unveils Innovative Printer and Dispense System
• VJE Showcases SRT Micra Rework Platform and Vertex II X-Ray Technology
• PVA Rolls Out Optical Bonding System
• ASM Assembly Systems Introduces SIPLACE Di-Series SMT Machines
• Fuji Machine Launches Hexafeeder and DynaHead
• Excelitas Technologies Introduces Surface Mount Pulsed Semiconductor Laser
• Fuji Machine Manufacturing Develops AIMEX II All-in-One Placement Machine
• ASM Unveils SIPLACE D1i and SIPLACE X3 S Placement Machines
• Fuji Machine Unveils NXT III
• Equipment Services Introduces SMT Screen Printers in North America
• ASM Assembly Systems Introduces SIPLACE X High-End Platform
• CyberOptics Unveils QX600 AOI System and SE500ULTRA SPI System
• Juki Extends Product Line
• Nikon Metrology Launches X-Ray Inspection System
• Orbotech Pacific Unveils PCB-Based Solutions
• Orbotech Introduces AOI Systems Series
• Viscom Introduces X8011 MXI System
• Test Research Showcases Closed Loop SPI Solution with Solder Paste Printer and Buffer
• Fuji Launches NXTP M35 Printer
• Speedline Technologies Unveils Camalot® Prodigy Dispense System and MPM Momentum® Printer
• MIRTEC Europe Unveils MV-9 2D/3D In-Line AOI Systems Range
• Vi Technology Unveils 2K Spectro AOI System
• Omron Unveils ptH Bench Top Model and Inline Post-Reflow Inspection System
• SMTmax Unveils QM-1500 Pick & Place Machine
• BTU International Introduces New Dynamo Convection Reflow Oven Platform
• MIRTEC Corporation Introduces MV-9 2D/3D In-Line AOI Machine
• DEK International Launches ProDEK in Europe
• BTU International Unveils New PYRAMAX 100A Oven System
• Fuji Introduces New NXT IIc Scalable Placing Platform
• Koh Young Technology Develops Closed Loop Interface Process Control Software
• Nordson DAGE Announces New and Enhanced Technical Specification for X-Ray Inspection System
• Orbotech Releases Discovery II AOI Series
• Orbotech Unveils Digital Production and Yield- Enhancement Solutions
• Viscom to Introduce New Linkage for X8011 PCB X-Ray Inspection Systems
• Viscom Redesigns X8011 Inspection System
• Viscom Completes Development of Latest High- Performance Inspection System

8. RECENT INDUSTRY ACTIVITY

• Nordson Acquires Dima Group
• Hunter Technology Acquires Spectral Response
• Plexus Expands Investment in SMT Line
• Valtronic Purchases New Surface Mount Assembly Equipment
• Valtronic Invests in AKS Typhoon - T15-1
• Juki Automation Systems Inks Agreement with JT Automation Equipment and JT Universal
• SmtXtra Inks Agreement to Acquire Elcoteq Hungary
• Shimadzu and Saki Ink Agreement
• Production Solutions and JUKI Automation Systems Sign Agreement
• Petronics Purchases MY12 Component Placement Machine from MYDATA
• JUKI Inks MOI with SONY
• Mer-Mar Selects Nordson YESTECH
• Nordson YESTECH Secures Contract from IEC Electronics
• Rad Communication Deploys 3D Automatic Inspection Machines of SAKI
• Viscom Selects Ostec Corporate Group
• LCL Electronics Enhances its Assembly Capacity
• Xitek Enhances its SMT capability
• SEMIKRON Selects Viscom's Automatic Optical Wirebond Inspection System
• ASM Assembly Systems to Enter into Collaboration with Technica USA
• PRIDE Industries Installs PYRAMAX 125A Reflow Ovens
• Elekonta Acquires Fusion 22 System from Orbotech
• Viscom Develops Viscom S3088 SPI System
• Smyczek Implements Viscom's Process Uplink and Solder Paste Inspection System
• Torenko and Associates Inks SMT Equipment Account
• Rehm Thermal Systems Selects X8011 X-Ray System of Viscom
• Electro Scientific Industries Takes Over EOLITE Systems
• ASM Pacific Technology Acquires Siemens Electronics Assembly Systems
• Panasonic Commences Operation of New SMT equipment Plant in China

9. FOCUS ON SELECT KEY PLAYERS

10. GLOBAL MARKET PERSPECTIVE 

Total Companies Profiled: 63 (including Divisions/Subsidiaries - 79)

• The United States (40)
• Japan (10)
• Europe (23)
• - France (3)
• - Germany (7)
• - The United Kingdom (7)
• - Rest of Europe (6)
• Asia-Pacific (Excluding Japan) (4)
• Middle East (2)

For more information visit http://www.researchandmarkets.com/research/qn4qmb/surface_mount

Media Contact: Laura Wood , +353-1-481-1716, Email Contact

To view the original version on PR Newswire, visit: http://www.prnewswire.com/news-releases/surface-mount-technology-smt-equipment---2015-global-strategic-business-report-3d-inspection-solutions-to-drive-growth-300053727.html

SOURCE Research and Markets