Surface Mount Technology (SMT) Equipment - 2015 Global Strategic Business Report: 3D Inspection Solutions to Drive Growth

DUBLIN, Mar. 20, 2015 — (PRNewswire) — Research and Markets

( http://www.researchandmarkets.com/research/qn4qmb/surface_mount) has announced the addition of the "Surface Mount Technology (SMT) Equipment - Global Strategic Business Report" report to their offering.

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The report provides separate comprehensive analytics for the US, Japan, Europe, Asia-Pacific, and Rest of World.

Annual estimates and forecasts are provided for the period 2013 through 2020. Also, a seven-year historic analysis is provided for these markets. Market data and analytics are derived from primary and secondary research. Company profiles are primarily based on public domain information including company URLs.

This report analyzes the worldwide markets for Surface Mount Technology (SMT) Equipment in US$ Thousands by the following Product Groups/Segments:

  • Screen Print Equipment (Manual Screen Print Equipment
  • Semiautomatic Screen Print Equipment, & Automatic Screen Print Equipment)
  • Placement Equipment Market (High-Speed Placement Equipment, Medium Speed Placement Equipment, & Low-Speed Placement Equipment)
  • Soldering Equipment (Reflow Oven, & Wave Oven)
  • Cleaning Equipment
  • Inspection Equipment (Optical Inspection Equipment, X-Ray Inspection Equipment, & Laser Inspection Equipment)
  • Repair and Rework Equipment (Manual Repair and Rework Equipment, & Semiautomatic Repair and Rework Equipment)

The report profiles 63 companies including many key and niche players such as:

  • ASM Assembly Systems GmbH & Co. KG (Germany)
  • Assembléon Netherlands BV (The Netherlands)
  • Conceptronic (US)
  • CyberOptics Corporation (US)
  • Electro Scientific Industries, Inc. (US)
  • Fuji Machine Manufacturing Co., Ltd. (Japan)
  • Glenbrook Technologies, Inc. (US)
  • Heller Industries, Inc. (US)
  • Juki Corporation (Japan)
  • Kabushiki Kaisha Hitachi Seisakusho (Hitachi, Ltd) (Japan)
  • Hitachi High Technologies Corporation (Japan)
  • Koh Young Technology, Inc. (South Korea)
  • Mycronic AB (Sweden)
  • Nikon Metrology NV (Belgium)
  • Nordson Corporation (US)
  • Omron Corporation (Japan)
  • Orbotech, Ltd. (Israel)
  • Panasonic Corporation (Japan)
  • Saki Corporation (Japan)
  • Speedline Technologies Inc. (US)
  • Teradyne, Inc. (US)
  • Test Research, Inc (Taiwan)
  • Universal Instruments Corporation (US)
  • Viscom AG (Germany)
  • YXLON International GmbH (Germany)

Key Topics Covered:

1. INDUSTRY OVERVIEW

  • Surface Mount Technology - An Introductory Prelude
  • Surface Mount Technology Equipment - Market Overview
  • Opportunity Indicators
  • Impact of 2007-2009 Economic Recession in Retrospect
  • Market Recovers in 2010
  • Market Turns Volatile Once Again Between 2011-2014
  • Natural Disasters take a Toll on PCB Assemblies in 2011 & 2012 - Slows Down Growth Prospects for SMT Equipment
  • Eurozone' Debt Crisis Drags SMT Equipment Market into the Red in 2012 & 2013
  • US Too Sees Significant Erosion in Demand for SMT Equipment in 2012 & 2013
  • Structural & Cyclical Downturn of Emerging Markets & Its Impact on the SMT Equipment Market During 2011-2013
  • Resurgence in Growth Fundamentals Encourages an Optimistic Market Outlook for the Year 2014 & Beyond
  • Steady Acceleration in Global PMI Benefits Augurs Well for the Market
  • Outlook
  • Asia-Pacific Continues to be Hotspot for Growth
  • 'The Booming ECMS Sector to Boost Demand for SMT Equipment in Asia-Pacific
  • Is China Loosing Sheen?
  • Competitive Scenario
  • Value Added Services Become Key Differentiator
  • Towards Consolidated Endeavors

2. NOTEWORTHY TRENDS & GROWTH DRIVERS

  • Need for Speed & Flexibility in Electronics Manufacturing Industry Spur Growth
  • Next Generation Electronics: Opens up Opportunities for SMT
  • Shrinking PCB Size Paints Brighter Prospects
  • Placement Equipment - The Traditional Revenue Contributor
  • Technological Innovations Set to Drive the Market in SMT Placement Equipment Market
  • Machine Vision Gains Stronger Roots in SMT Placement Equipment Market
  • Convergence Playing an Instrumental Role in Placement Equipment Market
  • Screen Print Equipment - The Fastest Growing Product Segment
  • Market Drivers and Restraints for Various Screen-Printers
  • Jet Printing Competes Stencil Printing in Screen Printer Market
  • SMT Screen Printer Equipment Vendors Go for Integrated Solutions
  • SMT Inspection Equipment to Gain Traction in Coming Years as Manufacturers Shift Focus from Defect Detection to Defect Prevention
  • Rising Adoption of Lead-Free Solder Strengthens Sales of Inspection Equipment
  • Right Timing' Influence Sales Patterns for SMT Inspection Equipment
  • Repair and Rework also Drives Demand for AXIs
  • Technological Advancements Spearheading Market Prospects for SMT Inspection Equipment
  • Growing Package Complexity Driving Business Case for Advanced Inspection Equipment
  • Drifting from Manual to Sensor-based Inspection Systems
  • 3D Inspection Solutions to Drive Growth
  • Productivity Optimization Drive Opens New Ground for Next Generation AOIs
  • AOI Segment Explores New Opportunities
  • Second Generation AOI Control Solutions: Design is the Key for Success
  • Advances in X-Ray Inspection Systems Drive Efficiency
  • SMT Soldering Equipment Sees Strong Growth Prospects
  • Trend-Setting Technologies
  • Intensifying R&D to Foster Growth
  • Lead-Free Solder: Emboldens Growth Opportunities
  • Slow But Steady Growth Opportunities for SMT Cleaning Equipment
  • Lead-Free Manufacturing Continues to Drive Demand
  • Difficulties Faced in the Cleaning of Lead-free Equipment
  • APT Drives the Market
  • Impact of Government Regulations on SMT Cleaning Equipment
  • Repair and Rework Emerge as an Integral Part of EMS - Drive Demand for SMT Repair & Rework Equipment
  • Escalating Assembly Costs Drive Demand for Rework Equipment
  • Growth in Electronic Manufacturing to Boost Market Prospects for SMT Equipment
  • A Look into Key Electronic Device Markets Driving Demand for PCB Assemblies and Therefore Critical to SMT Equipment Demand
  • Recovering Consumer Electronics Market to Spur Growth
  • Growing Adoption of Electronics in Automobiles Signals Prospects
  • Medical Device Industry Adds to the Demand for Advanced SMT Equipment
  • Medical Device Miniaturization to Boost Demand
  • Aerospace & Defense Sector - Add Another Dimension
  • LED Components Market - A Business Case for SMT Equipment
  • Demand for High-Mix' Equipment on Rise
  • Manufacturers Go Green'
  • Machine Vision: A Stitch in Time

3. CHALLENGES AND MARKET RESTRAINTS

  • SMT - Not Completely Free of Defects
  • Purchase Cycles Reward But Also Retard Growth
  • Commoditization Kills Price Differentials
  • Skewed Customer Profile Strains the Margins
  • Used Equipment: The Threat is Real
  • High Entry Barriers Hinder New Market Entrants
  • Density Packing Voices Concerns for High Quality Placement and Inspection
  • High False Calls and Escape Rates Dent Investor Confidence in SMT Inspection Equipment
  • Multiple Technologies Cannibalize Sales for SMT Inspection Equipment
  • Price Sensitivity: A Major Challenge for SMT Equipment
  • Pricing Undercuts Market Leadership

4. THE TECH PRIMER

  • Surface Mount Technology - A Curtain Raiser
  • Electronics Packaging Technology Prior to SMT
  • Packaging Without Holes
  • What Drives SMT Market?
  • Benefits of Surface Mounting
  • Higher Functional Density and Spatial Utilization
  • Substantial Reduction in Costs and Board Weights
  • Superior Electrical Performance
  • Shortened Time-to-Market
  • Initial Glitches
  • Type I, II and III Surface Mount Assemblies
  • Types of Surface Mount Packages
  • Small Outline Integrated Circuits (SOICs)
  • Plastic Leaded or Leadless Chip Carriers (PLCCs and LCCs)
  • Chip Scale Packages (CSPs)
  • Ball Grid Arrays (BGAs)
  • Micro Ball Grid Array (microBGAs)
  • Fine Pitch Devices
  • Surface Mounting - A Concise Overview of the Process
  • Defects - Intimidating Challenges to the Board Quality and Performance
  • Sources of Defects
  • Description of Process Related Defects
  • Cost of Defects
  • Surface Mount Design - The First Step
  • Designing Entails 80% of the Cost
  • What are Land Patterns?
  • Some Major Design Considerations
  • Spatial Considerations
  • Component Alignment Considerations
  • Via Holes
  • Number of Test Nodes
  • Prototype Inspection
  • Solder Paste Application/Paste Printing - The Blue Print
  • Important Considerations for Good Quality Printing
  • Why Use Solder Paste?
  • Which Type of Solder Paste to be Used?
  • Prerequisites of an Ideal Solder Paste
  • Regulations on the Usage of Solder Pastes
  • Component Placement - Mounting'
  • Prerequisites for Precise Placement
  • Soldering - Making the Electrical Connections
  • Reflow Soldering
  • Wave Soldering
  • Classification of Solder Joints
  • Good Solder Joint
  • Poor Solder Fillet
  • Shorts
  • Cleaning - Wiping off the Contaminants
  • Impact of Cleaning Processes on Component Choice
  • Inspection - Locating the Defects
  • Visual/Manual Inspection
  • Optical/Laser Inspection
  • X-Ray Inspection
  • Repair and Rework - Setting the Defects Right
  • Functional Testing - The Ultimate Step
  • Emerging Technologies, Challenges and the Roadmap for the Future

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