Call for Abstracts Deadline Extended! Designcon 2015
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Call for Abstracts Deadline Extended! Designcon 2015

 

 

Deadline to Submit Your Abstract Extended!
Submit by Friday, July 18th

The DesignCon 2015 Call for Technical Papers, Panels and Tutorials is drawing to a close! With the 4th of July festivities last week, we decided to give you an extra week to get caught up. DesignCon gives the chip, board & systems design engineering community the unique opportunity to gather for four days and learn the latest design techniques, methodologies and tools around SI & PI, high-speed serial design, PCB design tools, test & measurement and more.

Individuals presenting papers at DesignCon join an elite group offering leading-edge case studies, technology innovations, practical techniques, design tips, and application overviews. Submit your abstract for the chance to share your expertise in the areas of signal and power integrity, test & measurement and verification.

Deadline to submit is Friday, July 18, 2014.



SUBMIT PROPOSAL


The 2015 Topic Categories

The 2015 technical program will consist of 14 tracks:
  1. Optimize Chip-Level Designs for Signal and Power Integrity
  2. Overcome Analog and Mixed-Signal Modeling and Simulation Challenges
  3. Wireless and Photonic Integration
  4. System Co-Design: Chip/Package/Board: Modeling and Simulation
  5. Characterize PCB Materials and Processing Characterization
  6. Apply PCB Design Tools
  7. Design Parallel and Memory Interfaces
  8. Optimize High-Speed Serial Design
  9. Detect and Mitigate Jitter, Crosstalk, and Noise
  10. Leverage High-Speed Signal Processing for Equalization and Coding
  11. Ensure Power Integrity in Power Distribution Networks
  12. Achieve Electromagnetic Compatibility and Mitigate Interference
  13. Apply Test and Measurement Methodology
  14. Ensure Signal Integrity with RF/Microwave/EM Analysis Techniques

LEARN MORE


Who Should Submit?

Past DesignCon speakers include: Analog Engineers, Application Engineers, CTOs, Design Engineers, Directors of Engineering, Editors, EMC Engineers, Engineering Managers, Fellows, Hardware Engineers, Members of Technical Staff, Principal Engineers, Product Engineers, Professors, R&D Engineers, Signal Integrity Engineers, Systems Engineers, Technical Directors, VPs of Engineering and more.


How to Submit


Final papers will be due November 10, 2014. We look forward to receiving your submissions, and good luck!

Regards,

Katie Stern
Event Director
DesignCon 2015