Revenue Analysis |
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|
|
By Application |
4Q13 |
3Q13 |
4Q12 |
Computer |
1.9% |
1.8% |
1.0% |
Communications |
39.8% |
44.4% |
47.4% |
Consumer |
48.3% |
43.9% |
42.6% |
Others |
10.0% |
9.9% |
9.0% |
By Service Type |
4Q13 |
3Q13 |
4Q12 |
Wafers |
93.2% |
93.8% |
94.0% |
Mask making, testing, others |
6.8% |
6.2% |
6.0% |
By Customer Type |
4Q13 |
3Q13 |
4Q12 |
Fabless semiconductor companies |
86.7% |
87.7% |
86.6% |
Integrated device manufacturers (IDM) |
6.0% |
5.5% |
9.3% |
System companies and others |
7.3% |
6.8% |
4.1% |
By Geography |
4Q13 |
3Q13 |
4Q12 |
North America |
48.3% |
46.0% |
54.4% |
China(1) |
40.0% |
42.1% |
34.8% |
Eurasia(2) |
11.7% |
11.9% |
10.8% |
Wafer Revenue Analysis |
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|
|
By Technology (logic, memory only) |
4Q13 |
3Q13 |
4Q12 |
40/45 nm |
16.3% |
15.7% |
2.6% |
55/65 nm |
21.1% |
27.1% |
35.3% |
90 nm |
3.5% |
4.7% |
8.0% |
0.13 micrometers |
12.2% |
10.1% |
10.2% |
0.15/0.18 micrometers |
41.5% |
38.4% |
39.9% |
0.25/0.35 micrometers |
5.4% |
4.0% |
4.0% |
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Note: ( 1 ) Including Hong Kong , but excluding Taiwan ( 2 ) Excluding China |