Toshiba to Launch Ultra-compact MOSFETs for High-current Charging Circuits of Mobile Devices

Line-up expanded for high-power dissipation packages

TOKYO — (BUSINESS WIRE) — July 28, 2013Toshiba Corporation (TOKYO:6502) today announced that it has launched ultra-compact MOSFETs for the switches of high-current charging circuits, including 2 cell batteries, of mobile devices such as smartphones and tablets.

Toshiba's Ultra-compact MOSFETs for High-current Charging Circuits of Mobile Devices (Photo: Busines ...

Toshiba's Ultra-compact MOSFETs for High-current Charging Circuits of Mobile Devices (Photo: Business Wire)

As additional functions are added to mobile devices, such as smartphones and cellular phones, tablets and notebook PCs, and as more demands are made on their batteries, efforts continue to boost charge density and to improve the user experience by significantly increasing the charging current to cut charge times. The new ultra-compact "SSM6J781G" and "SSM6J771G" are Toshiba's latest additions to its high-current MOSFET line-up of high-power dissipation packages. Mass production shipment starts from today.

Applications
High-current charging switches for mobile devices like smartphones and cellular phones, tablets and notebook PCs.

Recommended Circuits
1. High-side switch (Pch)
2. High-side switch combining boost control LSI (Nch)
3. Control switch for low-side battery protection (Nch)

Key Features
1. High-current
2. Low ON-resistance
3. Low capacitance
4. Small package (1.5 x 1.0 mm; WCSP6C)
5. High-power dissipation (High PD)

Main Specifications

Nch MOSFET

Part number   VDSS
(V)
  VGSS
(V)
  ID(DC)
(A)
  RDS(ON) typ. (mΩ)   PD
(W)
VGS = 2.5V   VGS = -4.5V

SSM6K781G

  12   ±8   7   17.9   14.4   1.2
 

Pch MOSFET

Part number   V DSS
(V)
  V GSS
(V)
  I D(DC)
(A)
  R DS(ON) typ. (mΩ)   P D
(W)
V GS = -4.5V   V GS = -8.55V
SSM6J771G   -20   ±12   -5   26   23   1.2
 

1 | 2  Next Page »
Featured Video
Latest Blog Posts
Sanjay GangalIndustry Predictions
by Sanjay Gangal
AECCafe Industry Predictions for 2025 – DGG
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Equipment Engineer, Raxium for Google at Fremont, California
Sr. GIS Apps Product Engineer for ESRI at Portland, ME, Maine
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025
SIGGRAPH 2025 at Convention Centre Vancouver, British Columbia Canada - Aug 10 - 14, 2025



© 2025 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise