Alif Semiconductor will integrate ExecuTorch to significantly expand embedded capabilities of Endpoint-AI applications

Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing

Renesas Introduces Four-Channel Master IC and Sensor Signal Conditioner for the Growing IO-Link Market

Rambus Unveils Industry-First Complete Chipsets for Next-Generation DDR5 MRDIMMs and RDIMMs to Deliver Breakthrough Performance for Data Center and AI

Marvell Demonstrates Industry-Leading 3nm PCIe Gen 7 Connectivity for Accelerated Infrastructure at OCP 2024

indie Semiconductor’s Latest Vision Processor Design-win Momentum Accelerates, Awarded Sensor Innovation of the Year

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

AECCafe Today by Sanjay Gangal AEC Industry Predictions for 2025 — Leica Geosystems

Industry Predictions by Sanjay Gangal AECCafe Industry Predictions for 2025 – DGG

AECCafe Voice by Sanjay Gangal AECCafe Industry Predictions for 2025 – Autodesk

Principal Engineer for Autodesk at San Francisco, California

Senior Principal Software Engineer for Autodesk at San Francisco, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Sr. GIS Apps Product Engineer for ESRI at Portland, ME, Maine

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Mechanical Engineer 3 for Lam Research at Fremont, California

Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025

BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025

SIGGRAPH 2025 at Convention Centre Vancouver, British Columbia Canada - Aug 10 - 14, 2025