GBT is researching the Development of Electro-Thermal Aware Design Environment for Integrated Circuits

60th Design Automation Conference Names Executive Committee for the 2023 Conference and Exhibition

Dr. Giovanni De Micheli Honored with 2022 Phil Kaufman Award Presented by ESD Alliance and IEEE CEDA

Synopsys Advances Silicon Lifecycle Management to Accelerate Data Transport and Significantly Reduce Test Time

Siemens automates 2.5D and 3D IC design-for-test with new Tessent Multi-die solution

GOWIN Semiconductor New 22nm High-Performance FPGA Family - Arora V

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

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Senior Principal Software Engineer for Autodesk at San Francisco, California

Principal Engineer for Autodesk at San Francisco, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center Las Vegas NV - Jan 7 - 10, 2025

Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025

Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025

Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025