North American Semiconductor Equipment Industry Posts April 2019 Billings

OIF Continues Commitment to Interoperability with Two New Implementation Agreements

Agnisys to Unveil Specta-AV at DAC 2019 Signaling the End of Manual UVM Coding

Excellicon Introduces Automated Constraints Simulation to Minimize the Gate Level Simulation

2019 FLEX Korea Highlights Flexible Hybrid Electronics Technology Innovations and Opportunities

ANSYS Chief Executive to Present at Baird 2019 Conference

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

Bentley Systems by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

AECCafe Voice by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

Industry Predictions by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

Principal Engineer for Autodesk at San Francisco, California

Senior Principal Software Engineer for Autodesk at San Francisco, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington

Mechanical Engineer 2 for Lam Research at Fremont, California

Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024

Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025

Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025

BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025