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MACOM’s InnovationZone to Feature Industry Leaders in Cloud Data Center and 5G Connectivity Solutions at OFC 2019

Foxconn Interconnect Technology, Ltd. Announces Demonstration of 400G Bidirectional (BiDi) Multimode Fiber Transceivers at OFC 2019

OFC 2019: eSilicon to demonstrate two 7nm IP products: 56G DSP SerDes over a 5-meter Samtec cable assembly and a complete HBM2 PHY subsystem

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