Efficient Power Conversion (EPC) Introduces High Current Development Board Featuring Multiple Half-Bridges in Parallel

Anritsu VectorStar Part of Technical Workshop Conducted by DuPont Circuit & Packaging Materials and Rogers Corporation at DesignCon 2014

Electronics Enhancements In ANSYS 15.0 Bring Increased Fidelity To Users

Bruker Corporation Launches ContourSP 3D Optical Microscope for PCB Industry

SIT Adopts Silvaco's TCAD for Simulation of Wide Bandgap GaN Power Devices

Mentor Graphics’ Calibre PERC Reliability Checking Solution Used for IP Quality Program by TSMC

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

AECCafe Voice by Sanjay Gangal Morpheus Technology Group: Revolutionizing Application Integration for the Construction Industry

Industry Predictions by Sanjay Gangal Egnyte Showcases New Integrations to Streamline AEC Workflows at Autodesk University 2024

AECCafe Today by Sanjay Gangal Building the Future: Autodesk’s Vision for a Connected, Sustainable AECO Industry

Senior Principal Software Engineer for Autodesk at San Francisco, California

Principal Engineer for Autodesk at San Francisco, California

Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Equipment Engineer, Raxium for Google at Fremont, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024

Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024

Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024

Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024