G.Skill is first memory module manufacturer to have high speed, low power SO-DIMMs Advanced Tested on Intel® NUC platform

Supermicro® Unveils New 2-Node 4U FatTwin™ Supporting 12x Intel® Xeon Phi™ Coprocessors and New TwinPro™ Platforms featuring 12Gb/s SAS 3.0 and NVMe at Supercomputing 2013

Intel Announces First Commercial Availability of 4G LTE Modem; Introduces Module for 4G Connected Tablets and Ultrabooks™

SEMI Announces Silicon Wafer Shipment Forecast

Agilent Technologies Receives New Product Innovation Leadership Award for Handheld General-Purpose Test Equipment

JEDEC Announces Publication of e.MMC Standard Update v5.0

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

Bentley Systems by Sanjay Gangal Trimble’s Visionary Keynote Champions Connection and Innovation in the Construction Industry’s New Digital Era

AECCafe Voice by Sanjay Gangal Bentley Systems Enhances Carbon Analysis Capabilities to Tackle Infrastructure’s Carbon Footprint

Industry Predictions by Sanjay Gangal Designing the Hyperloop Dream: A Student-Led Odyssey in Future Mobility

Senior Principal Software Engineer for Autodesk at San Francisco, California

Principal Engineer for Autodesk at San Francisco, California

Equipment Engineer, Raxium for Google at Fremont, California

Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic

Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024

Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025

Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025

BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025