MaxLinear’s MxL683 Tuner + ISDB-T Demodulator SoC Powers “Time Shift” Televisions

Open-Silicon to Present on the Third-Party IP Market At IP-SOC Conference in Grenoble, France

IDT Wins EDN China 2012 Innovation Award for Smart Grid Single-phase Power Metering SoC

AIS Next Generation Low Cost ARM-Based HMI Thin Client for Industrial Automation and Process Control Applications

FXI Accelerates Development for ARM Cortex CPUs & ARM Mali GPUs with Cotton Candy Microcomputer

Akros Silicon SoC with Integrated Digital Isolation Supports 60W and 90W PoE Applications

Creating Timber Structures – Rafters - ArchiCAD 18 Training Series 3 – 11/52 GRAPHISOFT

Thom Mayne, FAIA, Celebrated with AIA Gold Medal AIA

Brian Wink, Director Field Architect Panzura

AECCafe Voice by Sanjay Gangal AECCafe Industry Predictions for 2025 – eQuorum

AECCafe Today by Sanjay Gangal AEC Industry Predictions for 2025 — Leica Geosystems

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Principal Engineer for Autodesk at San Francisco, California

Senior Principal Software Engineer for Autodesk at San Francisco, California

Sr. GIS Apps Product Engineer for ESRI at Portland, ME, Maine

Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania

Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin

Equipment Engineer, Raxium for Google at Fremont, California

Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025

BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025

SIGGRAPH 2025 at Convention Centre Vancouver, British Columbia Canada - Aug 10 - 14, 2025