One million wafers processed and leading edge 40nm low power RF CMOS technology IP developed to deliver the next-generation wireless connectivity user experience

Cambridge, —November 05, 2009 —CSR plc (LSE:CSR.L) today announced that it has shipped more than 1.5 billion units and processed more than one million wafers from foundry partner Taiwan Semiconductor Manufacturing Company (TWSE: 2330, NYSE: TSM). CSR also announced that it is collaborating with TSMC on a leading edge 40 nanometer (nm) low power (LP) RF process technology and that CSR has validated a broad range of proprietary connectivity IP blocks at this node for incorporation into their next generation Connectivity Centre SoCs.

As the pioneer in bringing single die Bluetooth products on RFCMOS technology, CSR has worked closely with TSMC over multiple generations of technologies and delivered a broad range of innovative products to mainstream consumer markets. CSR has shipped more than 1.5 billion products that drive connectivity across multiple markets including mobile phones, automobiles, computers and consumer electronics devices.

CSR's Connectivity Centre SoCs require a small form factor and lower power consumption to deliver seamless connectivity for next-generation wireless devices. TSMC’s 40nm LP RF process technology enables CSR to meet these objectives with highly integrated multi radio devices that allow the seamless coexistence of Bluetooth, GPS, Wi-Fi and FM radios. The two companies are leveraging their long relationship to help CSR achieve 40nm leadership with its multifunction radio integrated silicon platforms.

"TSMC consistently delivers cutting edge technology platforms that include integrated design collaterals and ecosystems. Our 40nm platform supports the high performance, low power, and high density RF products that will help CSR deliver next-generation experiences," said Mark Liu, Vice President of Advanced Technology Business at TSMC. "CSR is a demonstrated wireless technology leader because of their unique ability to bring these news experiences to reality."

"CSR’s close collaboration with TSMC is key to our ability to deliver significant advantages to our customers through industry-leading integration, power efficiency and cost efficiency of our products. We enable our customers to do more for less by selecting the technology nodes appropriate for the platform architecture we are delivering," said Mark Redford, Vice President Advanced Process Technology Development of CSR. "CSR’s highly integrated designs, with its portfolio of technology node optimized proprietary IP blocks, bring the best connectivity experience possible to wireless users worldwide."