Toshiba Announces Space-Saving Dual Channel IC-Couplers

Surface Mount Optocouplers in S08 Packages Reduce Board Area by 40 Percent Compared to Single-Channel Devices

IRVINE, Calif., April 8 /PRNewswire/ -- Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, has expanded its IC photocoupler lineup with three dual-channel, totem-pole output devices housed in low profile S08 packages. Each of these devices, developed by Toshiba Corp. (Toshiba), reduce board area by approximately 40 percent per channel compared to single-channel devices in MFSOP6 packages to help reduce size and cost of multi-channel applications.

Two 5Mbps devices include the TLP2105, with buffer logic output, and the TLP2108, with inverter logic output. Applications for these photocouplers include insulated bus drivers, high speed line receivers, and system interfaces for microprocessors.

The 15Mbps TLP2166A features inverter logic output and a supply voltage of 3.3V, making it suitable for high speed, low-voltage applications such as interfaces for digital measurement and control equipment, insulated PC boards and various communication protocols.

Technical Specifications TLP2105

    Specification           Symbol           TLP2105               TLP2108

    Package                                 S08 5.1mm x         S08 5.1mm x
                                             3.95mm x             3.95mm x
                                              2.5mm                2.5mm

    Output type                          General purpose,     General purpose,
                                          buffer logic        inverter logic
                                          (totem-pole)        (totem-pole)

    Power supply voltage      V(CC)        4.5 to 20V            4.5 to 20V

    Input current logic       I(F)           1.6mA                  1.6mA
     high output (max.)

    Logic low output          V(OL)           0.6V                   0.6V
     voltage (max.)

    Propagation delay time   t(pHL)          250ns                  250ns
     (max.) (H to L)

    Propagation delay time   t(pLH)          250ns                  250ns
     (max.) (L to H)

    Operating temperature    T(opr)   -40 degrees C to       -40 degrees C to
     range                              +100 degrees C         +100 degrees C

    Common-mode transient    CMR          +/-10kV/us             +/-10kV/us
     immunity (min.)

    Isolation voltage        BV(S)         2500Vrms               2500Vrms
     (min.)

Technical Specifications TLP2166A

    Specification                   Symbol

    Package                                      S08 5.1mm x 3.95mm x 2.5mm

    Output type                               General purpose, inverter logic
                                                        (totem pole)

    Power supply voltage          V(CC)                  3.0 to 3.6V

    Input current logic high      I(FHL)                    3mA
     output (max.)

    Propagation delay time
     (max.) (H to L)              t(pHL)                   75ns

    Propagation delay time        t(pLH)                   75ns
     (max.)  (L to H)

    Operating temperature         T(opr)              -40 degrees C to
     range                                             +100 degrees C

    Common-mode transient         CMR                  +/-15 kV/us
     immunity (min.)

    Isolation voltage (min.)      BV(S)                  2500Vrms

Pricing and Availability

Samples of the Toshiba dual-channel photocouplers are available now. Prices for the 5Mbps TLP2105 and TLP2108 are $1.72 in quantities of 100. The TLP2166A is priced at $2.00 each in quantities of 100.

1 | 2  Next Page »
Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise