Samsung’s New High-Performance Wireless USB SOC Solution Brings Short-Range Wireless Communications to CE Products

SEOUL, South Korea—(BUSINESS WIRE)—February 11, 2009— Samsung Electronics Co., Ltd., a worldwide leader in advanced semiconductor technology, today announced a new wireless universal serial bus (W-USB) System-On-Chip (SoC) designed specifically for the upcoming ultra-wideband (UWB) market. The latest in a growing portfolio of mobile technology solutions, Samsung’s new W-USB SoC combines the convenience of wireless connectivity, the security level of wired USB, and the high speed performance of UWB to instantly transfer mass storage data such as digital photos, movie videos or MP3 music files between electronic devices. For example, the new W-USB SoC can download a 700MB movie in approximately one minute.

Samsung’s suite of advanced products for portable consumer applications will be on display at the Mobile World Congress 2009 in Hall 1, Booth #D33 of the Fira de Barcelona, Montjuic.

“Connected consumer electronic products are the next step in enabling anytime, anywhere access to information and services,” said Dr. Yiwan Wong, vice president, System LSI Division, Samsung Electronics. “One of the keys to wireless connectivity is W-USB technology. While W-USB technology is just beginning to ramp up, its application will soon increase with the consumer electronic and mobile phone markets’ demand for wireless connectivity technology and UWB’s fast download speeds.”

This high-performance chip is expected to be applied to digital cameras and mobile phones and gradually expand to other peripheral electronic devices such as wireless printers, beam projectors, wireless hard disks, wireless displays, and wireless speakers. For example, without any cable connection, consumers can directly send photos from their digital cameras to their PC or view them instantly on their TV. Consumers can directly connect their MP3 players to high-quality surround speakers and listen to their favorite music. Also, multi-media data can be shared among mobile phones through a peer-to-peer network without a host computer.

Using advanced CMOS process technology and 3.1~10.6 GHz-band UWB technology, Samsung’s new W-USB SoC is a single chip solution which features a built-in ARM core, a UWB physical layer, and a memory controller. It also provides an SD card, an MMC, a NAND flash memory, and a high-speed USB 2.0 OTG (On-The-Go) interface without additional logic circuitry.

With the industry’s first built-in embedded memory controller and adoption of Samsung’s proprietary data storage technology, Samsung’s W-USB SoC offers a high throughput, performing at the speed of 480Mbps (megabytes per second). When considering a conventional payload overhead, the average effective data download speed of existing chipsets is around 50Mbps while Samsung’s W-USB SoC can reach up to 120Mbps.

Samsung’s new W-USB SoC utilizes security measures which are seamless with features such as a 128 bit AES (Advanced Encryption Standard) encryption algorithm and a static signal that makes hacking through wiretapping and signal tracing difficult.

This new SoC maintains a low power consumption of less than 300mW (milliwatt), making it an ideal product for portable electronic devices like mobile phones and digital cameras.

According to the market research analysis firm In-Stat, worldwide W- USB is expected to reach US$22 million this year and increase to US$390 million in 2012, at an annual compound growth rate of over 200 percent.

Samsung’s W-USB SoC is currently sampling and will be in mass production starting in Q2, 2009.

About Samsung Electronics

For more information, please visit www.samsung.com or www.samsung.com/us/business/semiconductor/news/News_MediaCenter.html.

Reference

Wireless USB Chip Market Forecast (‘08~’12)

                       

(Unit: Mpcs)

    2008   2009   2010   2011   2012   Percentage of Average Growth Per Year
Wireless USB   0.7   3.2   21.4   75.7   193.3  

315%


1 | 2  Next Page »
Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise