Qimonda DDR3 Modules Validated on Upcoming Intel High-End Desktop Platform; Industry Transition to DDR3 Memory Accelerates with Latest Technology Release

MUNICH, Germany—(BUSINESS WIRE)—September 25, 2008— Qimonda AG, a leading manufacturer of memory products, announced validation of its 1 GB and 2 GB DDR3 Unbuffered Dual In-Line Memory Modules (UDIMMs) on the upcoming Intel® Core i7 processor and Intel® X58 Express chipset, bringing the exceptional thermal efficiency and performance of Qimonda memory to this next generation high-end desktop platform.

Validation of the DDR3 1067 non-ECC UDIMMs for the new Intel Core i7 platform being released later this year reinforces Qimondas leadership role in the industry transition to a memory standard that provides up to 30% improvement in power usage while offering up to twice the data rate of DDR2 memories. Qimonda DDR3 components were initially released more than one year ago, and Qimonda DDR3 modules have now been validated on multiple Intel platforms.

With an integrated controller supporting up to three memory modules per channel, the Intel Core i7 microarchitecture fully leverages the performance of DDR3 memory to deliver exceptional memory bandwidth while reducing memory latency. DDR3 is also the first memory designed for operation at 1.5V, making it an ideal match to the power efficient Intel processor and chipset architectures.

Weve worked closely with Intel to validate DDR3 modules for application in Core architecture systems across the full range of supported platforms, said Michael Buckermann, Vice President of Business Unit Computing, Qimonda AG. We are very pleased to be able to offer these solutions as part of the industrys broadest portfolio of DDR3 DIMMs from 800 to 1866 speed grades.

Qimonda has been a valued partner in enabling Core microarchitecture platforms and participating in our program for evaluation of memory energy efficiency and performance, said Paul Fahey, Director of Platform Memory Operations, Intel Corporation. The company has consistently met the requirements for power use and thermal performance across all platforms, and weve selected Qimonda DIMMs for several channel partner and media evaluation programs in our platform roll-outs this year.

About Qimonda

Qimonda AG (NYSE:QI) is a leading global memory supplier with a broad diversified DRAM product portfolio. The company generated net sales of Euro 3.61 billion in financial year 2007 and had approximately 13,500 employees worldwide. Qimonda has access to four 300mm manufacturing sites on three continents and operates six major R&D facilities. The company provides DRAM products for a wide variety of applications, including in the computing, infrastructure, graphics, mobile and consumer areas, using its power saving technologies and designs. Further information is available at www.qimonda.com.

Disclaimer

This press release contains forward-looking statements based on assumptions and forecasts made by Qimonda management and third parties. Statements that are not historical facts, including statements about our beliefs and expectations, are forward-looking statements. These statements are based on current plans, estimates and projections, and speak only as of the date they are made. We undertake no obligation to update any of them in light of new information or future events. These forward-looking statements involve inherent risks and are subject to a number of uncertainties, including trends in demand and prices for semiconductors generally and for our products in particular, the success of our development efforts, both alone and with our partners, the success of our efforts to introduce new production processes at our facilities and the actions of our competitors, the availability of funds for planned expansion efforts and the outcome of antitrust investigations and litigation matters, as well as other factors. We caution you that these and a number of other known and unknown risks, uncertainties and other factors could cause actual future results, or outcomes to differ materially from those expressed in any forward-looking statement. These factors include those identified under the heading "Risk Factors" in our most recent Annual Report on Form 20-F and our prospectus supplement filed with the SEC on February 11, 2008, each of which is available without charge on our website and at www.sec.gov.



Contact:

Qimonda AG
Worldwide Headquarters:
Ralph Heinrich, +49 89 60088 1300
Email Contact
U.S.A.:
Glen Haley, +1 919-677-4554
Email Contact
Asia:
Isabel Chen, +886 2 8170 8177
Email Contact
Japan:
Kenichi Sugiyama, +81 3 5745 7495
Email Contact
Investor Relations Europe & Asia:
Andreas Schaller, +49 89 60088 1200
Email Contact

Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise