SAN FRANCISCO — (BUSINESS WIRE) — December 10, 2024 — The Compact Model Coalition of the Silicon Integration Initiative (Si2) has issued a call for papers for its inaugural International Compact Modeling Conference (ICMC), scheduled for June 26-27, at the Cliff Royal Sonesta Hotel, San Francisco.
Researchers, academics, and industry professionals are invited to submit proposals for ICMC, which will explore the theme of “Strengthening Model Collaboration with the Semiconductor Industry.” Co-sponsored by IEEE EDS, ICMC will focus on compact device models, their development, and their broad application in the semiconductor industry.
The abstract submission deadline is January 15, 2025. Click here for complete details on the call for papers and the conference.
About Si2
Si2 is a not-for-profit membership organization for suppliers and users who innovate and collaborate on trusted standards and share solutions that lower development costs and increase semiconductor design productivity. Si2 members include corporations, institutions, and academia. Si2 plays a crucial role in providing users and suppliers with access to shared technical solutions. For more information visit https://si2.org/.
View source version on businesswire.com: https://www.businesswire.com/news/home/20241210863685/en/
Contact:
Terry Berke
737-326-7590
tberke@si2.org
