Intrinsic ID Presents Full Range of Chip Security Solutions at TSMC 2022 Open Innovation Platform Ecosystem Forum

Trends in advanced semiconductor design – such as smaller processing nodes and chiplet-based designs – underscore need for scalable security solutions; Intrinsic ID to showcase security expertise on site in North America OIP event on October 26 and virtual event on November 10.

Intrinsic ID will be participating in the TSMC 2022 Open Innovation Platform® (OIP) Ecosystem Forum, on October 26, 2022 at the Santa Clara Convention Center. We will showcase our full line of patented SRAM PUF technology solutions implemented in hardware ( QuiddiKey), software ( BK) and on FPGAs ( Apollo) in our booth 515.

The TSMC OIP Ecosystem Forum is a one-of-a-kind event that brings together the semiconductor design ecosystem partners and TSMC customers to discuss the latest technologies and design solutions for high performance computing, mobile, automotive, and IoT applications. At the 2022 North America TSMC OIP Ecosystem Forum in Santa Clara, we will be on site providing customer demos of our technology and industry-leading PUF-based security solutions. We invite you all to stop by booth 515 this Wednesday. You can register here for attending the event.

In addition, our CEO and co-founder Pim Tuyls will present a talk titled “Securing Systems-In-Packages with PUF Technology,” during the virtual part of this event on November 10, 2022. He will discuss the benefits of using PUF technology to secure the increasingly popular approach of System-in-Package (SiP) design. The presentation will highlight how PUFs are used to create a hardware root-of-trust on every individual chiplet in SiPs, even on the ones produced in advanced technology nodes where having non-volatile memory is often not an option. The online event is available for the global TSMC audience, so people can log in from anywhere to watch the presentation.