Ansys Simulation Helps Accelerate Next-Gen Wireless Communication for Murata Manufacturing

PITTSBURGH, Oct. 27, 2022 — (PRNewswire) —  As part of a new multiyear agreement, Ansys' (NASDAQ: ANSS) industry-leading simulation tools will help Murata Manufacturing Co., Ltd. (Murata) develop electronic components for efficient, next-generation wireless communication and mobility products.

Leveraging Ansys' expansive simulation portfolio will help Murata improve the efficiency, performance and quality of its electronic components, which include radio frequency (RF) modules, multilayer resin substrates known as MetroCirc, and multilayer ceramic capacitors (MLCC). These components are essential in expanding high-frequency communications to support new-age connectivity demands while upholding sustainability initiatives.   

The new multiyear agreement builds on Ansys' existing relationship with Murata. Ansys® HFSS™ 3D high-frequency electromagnetic simulation software helped enable the development of an efficient direct-current-resonance method for wireless power transfer systems, which have the potential to charge more devices than batteries or wired systems have the capacity to power.

"Murata is leading innovation in wireless connectivity components and working toward a better environment by advancing technology for an Internet of Things (IoT) connected society," said Norio "Nick" Yoshida, general manager of the computer-aided design (CAD)/computer-aided engineering (CAE) department at Murata. "Through this agreement, Ansys' simulation solutions will support our design and development initiatives while enabling us to meet our sustainability goals and help expand our global market."

The team will implement Ansys' electronics system design tools to develop high-frequency devices and communications modules for the future that feature low-power consumption, high-power performance, and improved reliability. With the ability to model phenomena such as electromagnetic interference (EMI), electromagnetic compatibility (EMC), and radio frequency interference (RFI), Ansys tools will help to solve complex and large-scale electronics engineering challenges.

"With wireless networks based on the technology of 5G and beyond, the demands of connectivity modules and components increase significantly," said John Lee, vice president and general manager of the electronics, semiconductor, and optics business unit at Ansys. "Ansys' simulation solutions not only meet today's rising demands but remain ahead of them, and we are confident that Ansys' electronics system design tools will equip Murata to develop the wireless connectivity possibilities of tomorrow."

/ About Ansys

When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys.

Take a leap of certainty … with Ansys.

Ansys and any and all ANSYS, Inc. brand, product, service and feature names, logos and slogans are registered trademarks or trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All other brand, product, service and feature names or trademarks are the property of their respective owners.

ANSS–C

/ Contacts

Media

Mary Kate Joyce                   


724.820.4368                    


Email Contact 



Investors

Kelsey DeBriyn


724.820.3927


Email Contact

 

Cision View original content to download multimedia: https://www.prnewswire.com/news-releases/ansys-simulation-helps-accelerate-next-gen-wireless-communication-for-murata-manufacturing-301661263.html

SOURCE Ansys

Contact:
Company Name: Ansys, Murata Manufacturing
Financial data for Ansys, Murata Manufacturing

Featured Video
Latest Blog Posts
Sanjay GangalAECCafe Today
by Sanjay Gangal
AEC Industry Predictions for 2025 — vGIS
Sanjay GangalIndustry Predictions
by Sanjay Gangal
AEC Industry Predictions for 2025 — QeCAD
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center Las Vegas NV - Jan 7 - 10, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise