Ventec’s PCB Base Material Solutions at electronica India

06 September 2022 – Ventec International Group Co., Ltd. (6672 TT), will be exhibiting at electronica India 2022. From 21 to 23 September 2022, visitors to Ventec’s booth EP12 in the IPCA Expo area (Hall 12) will be invited to discover the company’s unique laminate & prepreg capability across a very wide range of applications and budgets - all supported by a fast and efficient global delivery promise through Ventec's fully controlled and managed global supply chain and world-class dependable technical support.

The key focus on Ventec’s booth EP12 will be: 

tec-speed: Ventec’s comprehensive and enhanced set of high-performance, high-reliability high-speed/low-loss/high-frequency solutions, including:

  • tec-speed 30.0 - Ventec’s latest ceramic filled high-speed/high-frequency PTFE material range that offers the highest signal-integrity characteristics for the most advanced high-frequency systems such as 77~79 GHz automotive radar systems.
  • tec-speed 20.0 - Few substrate materials can match the high-speed signal-handling performance of this ceramic-filled hydrocarbon thermoset material series. tec-speed 20.0 combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and highest reliability particularly demanded by automotive and 5G applications.
  • tec-speed 6.0 - High-speed, high-frequency material technology for applications requiring great signal integrity and low-Dk benefits with high reliability. Ventec’s material formula also features high Conductive Anodic Filament (CAF) resistance to offer highest assurance of reliability in humid environments.

tec-thermal: Ventec's IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs, leverage innovative formulas for excellent thermal performance. Highlights include:

  • VT-4B5 SP - an aluminum base laminate that ensures maximum thermal efficiency for direct-to-metal connections of electrically isolated heat sources and places dielectric insulation only where needed.
  • VT-4B5L - a high-performance IMS material that offers excellent solder joint reliability and thermal conductivity of 3.6 W/mK.

autolam: a PCB base material solutions set specifically curated for the diverse and unique requirements of automotive applications. Highlights include:

  • VT-4B5H - a metal base laminate material with high Tg (180 Celsius) and thermal conductivity of 4.2 W/mK, ideally suited for applications such as LED lighting, power conversion, monitor drives and power supply.
  • VT-4B7 - a high-performance IMS material for applications where maximum thermal conductivity and electrical performance are key. Specified at 7.0 W/mK, VT-4B7 is an affordably priced substrate that competes strongly with direct-bond copper (DBC).

“India is a market with huge growth potential for Ventec. Together with CBC PCB, our distributing partner for India, we're incredibly excited to be exhibiting at electronica India for the first time and can't wait to share our expertise and knowledge with the many visitors to the show,” said Chris Hanson, VP IMS Technology. 

Ventec International is a world leader in the production of polyimide & high-reliability epoxy laminates and prepregs and a specialist provider of thermal management and IMS solutions. Further information about Ventec’s solutions and the company’s wide variety of products is available at www.venteclaminates.com.

-- Ends --

About Ventec International Group

Ventec International Group Co., Ltd. (6672 TT) is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support network.
For more information, visit www.venteclaminates.com


Safe Harbor Statement

This press release contains projections and other forward-looking statements regarding future events or our future financial performance. All statements other than present and historical facts and conditions contained in this release, including any statements regarding our future results of operations and financial positions, business strategy, plans and our objectives for future operations, are forward-looking statements. These statements are only predictions and reflect our current beliefs and expectations with respect to future events and are based on assumptions and subject to risk and uncertainties and subject to change at any time. We operate in a very competitive and rapidly changing environment. New risks emerge from time to time. Given these risks and uncertainties, you should not place undue reliance on these forward-looking statements. Actual events or results may differ materially from those contained in the projections or forward-looking statements. Some of the factors that could cause actual results to differ materially from the forward-looking statements contained herein include, without limitation: (i) the contraction or lack of growth of markets in which we compete and in which our products are sold (ii) unexpected increases in our expenses, including manufacturing expenses, (iii) our inability to adjust spending quickly enough to offset any unexpected revenue shortfall, (iv) delays or cancellations in spending by our customers, (v) unexpected average selling price reductions, (vi) the significant fluctuation to which our quarterly revenue and operating results are subject, (vii) our inability to anticipate the future market demands and future needs of our customers, (viii) our inability to achieve new customer wins or for customer wins to result in shipments of our products at levels and in the timeframes we currently expect, (ix) our inability to execute on strategic alliances, (x) the impact of natural disasters on our sourcing operations and supply chain, and (xi) other factors detailed in documents we file from time to time with the Securities and Exchange Commission.


Media Contact

Kim Sauer (Mr)
Global Marketing Communications
Ventec International Group

Email:  Email Contact
Mobile: +44 7906 019 022
www.venteclaminates.com

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