- Reliability developments in RF/mmW/5G devices
- Circuit reliability & aging – Aging aware designs and design tools
- Emerging memory technology reliability and design architectures
- Neuromorphic computing reliability
- Four keynote speakers from Intel, Synopsys, Micron, and TSMC
- A series of 18 90-minute tutorial sessions, designed to provide a comprehensive overview of reliability topics
- Interactive evening workshops covering 10 different reliability focus areas
- More than 60 posters will be presented during the poster session
- A supplier exhibition will be held in conjunction with the Symposium
DALLAS, TX (March 9, 2022) – The upcoming 2022 IEEE International Reliability Physics Symposium (IRPS), the industry’s premier technical conference for engineers and scientists to present the latest original research in microelectronics reliability, will be held as an in-person event with a virtual component from March 27 – 31, 2022 at the Hilton DFW Lakes Executive Conference Center in Grapevine, TX. The Symposium will feature a number of special focus sessions highlighting novel and emerging areas of electronic reliability, as well as topics relating to conventional semiconductor, integrated circuit, and microelectronic assembly reliability.
The 60th annual IRPS will feature a technical program of more than 140 invited and accepted papers delivered by leading reliability scientists and engineers from around the world. It will include 18 90-minute tutorial sessions throughout the conference, as well as interactive evening workshops covering 10 different reliability topics on Tuesday, March 29. More than 60 posters will be presented at the poster session on Wednesday, March 30.
After the conclusion of the conference, on demand access to all of the presentations, posters, Q&A communications, as well as ongoing post conference chat capability with the authors will be made available to all registrants (in person and virtual attendees) for the month of April.
“The Symposium technical program continues to deliver the latest research in microelectronics reliability, including wide bandgap semiconductors, neuromorphic computing reliability, advanced memory technologies, and RF/mmW/5G device reliability,” said Chris Connor, Intel, and IRPS vice general chair. “This year’s hybrid conference format features a comprehensive program of tutorials and workshops that provide an unparalleled overview of semiconductor reliability topics.”
“As the only comprehensive reliability conference that covers the entire scope of device, circuit, and systems reliability, IRPS presents more leading work in many different areas, including both silicon and non-silicon devices, process technology, memories, packaging, circuits, and systems reliability,” said Charles Slayman, Cisco Systems, and IRPS 2022 general chair. “IRPS continues to draw reliability professionals around the world from industry, academia, and government with a superior program of the most advanced reliability research, combined with continuing educational opportunities in the form of our tutorials and workshops. With the acceleration of neuromorphic computing systems, SiC and GaN wide bandgap devices, and advanced wireless technologies, IRPS continues to be a premier forum to discuss critical reliability issues in these emerging fields.”
Here are details of the 2022 IRPS program:
- “Reliability at Scale: Pushing the Boundaries of Reliability and Quality at the Frontiers of Compute,” by Moshen Alavi, corporate VP & GM of Quality & Reliability, Intel
- “Silicon Lifecycle Management: Increasing Semiconductor Predictability in an Unpredictable World,” by Shankar Krishnamoorthy, GM, Digital Design Group, Synopsys
- “Transformation of Memory and Storage Hierarchy: Enabling High Performance, Reliable, and Sustainable Compute Applications,” by Nagasubramaniyan Chandrasekaran, Senior VP, Technology Development, Micron
- “New Reliability Ecosystem: Maximize Technology Value to Serve Diverse Markets,” by Jun He, VP Corporate Quality & Reliability, TSMC
IRPS offers a comprehensive series of 90-minute tutorial sessions in conjunction with the Symposium program. Presented by reliability experts from industry, academia, and government, these sessions provide an overview of semiconductor, circuit, and system reliability that can only be found at IRPS. Tutorial topics for 2022 include:
Sunday
- Interaction of HCI, BTI & TDDB
- Transition Metal Dichalcogenides: Process, Scaling, Performance & Reliability
- Health Management of Systems Using Telemetry & Machine Learning
- Failure Analysis and its Relationship to Reliability & Product Quality
- Mechanical Effects in BEOL
- 3D Interconnect Reliability – A Status
Monday
- A Common Physical Framework for CMOS Front End Reliability - BTI, HCD and TDDB
- RF/mmWave/5G Reliability
- High-Density Electronic Circuits Made of 2D Materials: Towards Their Integration in CMOS Silicon Chips
- GaN Power Devices: Operation, Trapping & Reliability
- Effects of Defects in SiC Epilayers on Device Yield & Reliability
- Automotive Use Conditions—Trends & Reliability Challenges
- Flash Memory Reliability and Error Mitigation in Modern SSDs
- Phase Change Memory (PCM) Reliability
- Probabilistic Design for Reliability in Electronics and Photonics: Role, Significance, Attributes, Challenges
- Advanced CMOS Technology Challenges for Robust ESD Designs
- On-Chip ESD: Design and Verification
- Analog ESD Design Integration Challenges
Workshops – Tuesday, March 29
The IRPS program has traditionally included a series of workshops, divided into two 50-minute sessions. Each workshop session features industry experts as moderators to introduce a specific reliability topic, and guide attendees in their dialog/discussions, as well as produce a summary of the session to be shared with the IRPS community. The Tuesday evening workshops will not be available to remote attendees. Workshop sessions include:
First Workshop Sessions
- The Dawn or Dusk of “Transistor Reliability” Physics?
- Neuromorphic Computing
- GaN Wide Bandgap
- ESD and Latchup (IEW)
- Failure Analysis
Second Workshop Sessions
- Gate-All-Around Devices: Performance Improvement at What Reliability Cost?
- Density Fluctuation Theory
- Emerging Memory
- Latchup Testing
- Time Dependent Dielectric Breakdown
IRPS Reliability Year in Review – Monday, March 28
Providing attendees with a comprehensive review of developments and advances in reliability technology over the past year, the annual “IRPS Year in Review” session will include three presentations:
- 3D IC Packaging – Presented by Kangwook (Kriss) Lee, SK hynix
- Emerging Memory Reliability (MRAM, RRAM, PCM, Ferroelectrics) – Presented by Shimeng Yu, Georgia Tech
- Reliability & Aging-Aware Design / Circuit Reliability – Presented by Evelyn Landman, proteanTecs
Poster Session – Wednesday, March 30
- A poster session featuring more than 60 posters will be presented virtually on March 30 from 6:00 p.m. – 9:00 p.m. The poster session will not be available to remote attendees.
Vendor Exhibition
- The 2022 IRPS will include a vendor exhibit, showcasing the latest products and services provided by participating companies. The exhibition is open to all in-person IRPS attendees.
About IRPS
The IEEE International Reliability Physics Symposium (IRPS) is the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic assemblies through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability, and to meet and network with reliability colleagues from around the world.
