Renesas Adds New Entry-Line RA2E1 MCU Group to RA Family to Address Cost-Sensitive and Space-Constrained Applications

Based on the 32-bit Arm Cortex-M23 Core, 48 New RA2E1 MCUs Encompass a Wide Range of Memory, Operating Voltage and Package Options

TOKYO — (BUSINESS WIRE) — January 27, 2021 — Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its 32-bit RA2 Series microcontrollers (MCUs) with 48 new RA2E1 Group MCUs. Based on the 48-MHz Arm® Cortex®-M23 core, the RA2E1 MCUs are entry-line, single-chip devices with up to 128-KB code flash and 16-KB SRAM memory.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210127005266/en/

Entry line RA2E1 MCU Group addresses cost-sensitive and space-constrained applications (Graphic: Business Wire)

Entry line RA2E1 MCU Group addresses cost-sensitive and space-constrained applications (Graphic: Business Wire)

The RA2E1 Group MCUs support a wide operating voltage range of 1.6V to 5.5V and a large selection of packages such as LQFP, QFN, LGA, BGA and Wafer Level Chip Scale Package (WLCSP). They deliver optimized combinations of superior performance, ultra-low-power consumption, innovative peripherals and small package options. These features make the RA2E1 Group ideal for cost-sensitive applications and other systems requiring high performance and low-energy consumption in space-constrained applications. The new MCUs offer an upgrade path with hardware and software scalability, so they are the perfect entry point into the wide line-up of the Renesas RA family.

“The RA2E1 Group is an important addition to our RA Family,” said Roger Wendelken, Senior Vice President of Renesas’ IoT and Infrastructure Business Unit. “These devices are outstanding for any designer, delivering a wide-range of popular features and options for applications, such as consumer products, appliances and industrial equipment. Additionally, they serve as an entry point into our RA2 Series, offering seamless upgrade to larger RA Family devices with hardware and software scalability.”

The upgraded low power capability in the RA2E1 MCUs cover all on-chip peripherals, the flash memory and SRAM. This capability allows the smallest possible power consumption over the devices’ entire temperature and voltage range. System design flexibility is maximized across diverse applications via multiple low power modes. When benchmarked for power consumption, the RA2E1 MCU was certified with an EEMBC® ULPMark™ score of 321 at 1.8V, verifying its best-in-class power rating. Users can now minimize active power consumption close to standby levels to extend battery life.

Key Features of the RA2E1 MCU Group

  • 48 MHz Arm Cortex-M23 CPU core
  • Integrated flash memory options from 32KB to 128KB; and 16KB RAM
  • Support for wide operating voltage range: 1.6V - 5.5V
  • Pin counts from 25- to 64-pin
  • Package options including LQFP, QFN, LGA, BGA and WLCSP (2.14 x 2.27mm)
  • Low power operation: 100µA/MHz in active mode; 250 nA in software standby
  • Integrated next generation innovative capacitive touch sensing unit with no external components required, lowering BOM costs
  • Enables system costs reduction with on-chip peripheral functions, including a high precision (1.0 percent) internal oscillator, background operation data flash supporting 1 million erase/program cycles, high-current IO ports, and a temperature sensor
  • Pin and peripheral compatibility with RA2L1 Group devices for quick and easy upgrade paths

The RA2E1 MCUs also offer an IEC60730 self-test library and feature integrated safety functions that provide confirmation of normal operation. Customers can easily use these safety functions to perform MCU self-diagnostics. In addition, the RA2E1 devices include an AES cryptography accelerator, true random number generator (TRNG) and memory protection units that provide the fundamental blocks to develop a secure IoT system.

The RA2E1 Group is supported by the easy-to-use Flexible Software Package (FSP), which includes a best-in-class HAL driver. The FSP uses a GUI to simplify and dramatically accelerate the development process, while also making it easy for customers to transition from an original 8/16-bit MCU design. Designers using the RA2E1 MCUs also have access to the extensive Arm partner ecosystem, offering a wide range of tools that help speed time-to-market.

The RA2E1 MCUs can be combined with Renesas’ complementary analog and power offerings to create comprehensive solutions for a variety of applications. Renesas has released a series of these “Winning Combinations” that include Arm core processors and are suitable for the low-cost, low pin-count and low-power of the RA2E1 MCUs. More information on Winning Combinations is available at www.renesas.com/WIN. The RA2E1 kits also support new extended PMOD connectors to facilitate modular IoT using sensor PMODs and RF connectivity PMODs.

Availability

The RA2E1 MCUs are available now from Renesas’ worldwide distributors. For more information and an evaluation board, please visit: https://www.renesas.com/ra2e1.

About Renesas Electronics Corporation

Renesas Electronics Corporation ( TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, Infrastructure, and IoT applications that help shape a limitless future. Learn more at renesas.com. Follow us on LinkedIn, Facebook, Twitter, and YouTube.

(Remarks). Arm and Arm Cortex are trademarks or registered trademarks of Arm Limited in the EU and other countries. ULPMark is a registered trademark of the Embedded Microprocessor Benchmark Consortium. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.



Contact:

Americas
Don Parkman
Renesas Electronics Corporation
+ 1-408-887-4308
don.parkman.xh@renesas.com

Featured Video
Jobs
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise