MILPITAS, Calif. – June 10, 2020 – SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components. Review the full RFP for more information about the proposal submission process. Product demonstrations are required for award consideration. The RFP topics include:

• Power and power integration
• Reliability
• Electronics environmental sustainability
• Advanced heterogeneous packaging for FHE
• Materials advances
• Soft robotics
• Stretchable electronics

SEMI FlexTech’s Technical Council will evaluate, prioritize, review and manage the proposals and their resulting projects. Funding granted by SEMI FlexTech for the projects must be matched with funds in the form of cash and in-kind contributions from the grant recipient to cover total project costs. On average, industry typically covers 60 percent of the funding for the development program.

“We invite proposals for leading-edge innovation,” said Melissa Grupen-Shemansky, executive director and CTO of SEMI FlexTech. “We look forward to fielding proposals that push the state-of-the-art of flexible and printed electronics to not only enable lighter and thinner electronics but advance device lifetime and robustness using environmentally sustainable processes and materials. FHE continues to transform electronics for industries including healthcare, transportation and communications.”  

SEMI FlexTech will support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by SEMI FlexTech are in the U.S. government’s Technology Readiness Level (TRL) 3-6 and Manufacturing Readiness Level (MRL) 1-3 levels.

SEMI FlexTech anticipates announcing multiple awards to teams or U.S. organizations with research and development capabilities. White paper proposals are due July 10, 2020 at 5:00 PM PDT.

During a webinar on June 17, 2020, at 9:00 am PDT, SEMI FlexTech will answer questions about the RFP. Register for the webinar. The recorded webinar will be available after the live event at www.flextech.org.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit  www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn and  Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email:  mhall@semi.org