LC3 for Bluetooth LE Audio Now Available for Cadence Tensilica HiFi DSPs

HiFi customers can immediately benefit from latest performance enhancements enabled by new Bluetooth audio mode

SAN JOSE, Calif. — (BUSINESS WIRE) — January 6, 2020 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that an implementation of the Low Complexity Communications Codec (LC3) that is expected to be compliant with LE Audio, the next generation of Bluetooth audio, is available now for Cadence® Tensilica® HiFi DSPs and has been delivered to a lead customer. LC3 provides higher audio quality at lower bandwidth and affords developers greater flexibility in making tradeoffs between audio quality, power consumption and other features for a more optimal user experience. Cadence licensed reference code from Fraunhofer IIS to enable availability of LC3 in conjunction with the initial LE Audio launch, allowing customers to immediately benefit from the latest enhancements including longer battery life, improved connectivity and multi-user sharing.

“Consumer demand for a wide range of Bluetooth audio-based products from headphones and TWS ear buds to portable speakers continues to explode. We are excited that our contributions to LC3 help deliver higher quality and more robust experiences,“ said Marc Gayer, head of business department in the audio and multimedia division of Fraunhofer IIS. “We worked early on in the development of the codec to ensure that LC3 would run extremely efficiently on the Cadence Tensilica HiFi Audio DSP architecture, which translates to extended battery life for consumers.”

“The fact that the LC3 codec can provide very high-quality audio even at low bitrates makes it a key feature of the upcoming LE Audio standard,” said Mark Powell, executive director of the Bluetooth Special Interest Group (SIG). “We are pleased to see member companies working on implementations of the LC3 codec optimized for various processor architectures.”

“Fraunhofer continues to prove that it is an innovative leader in the world of audio/voice codecs with its critical contributions to the new LC3 standard,” said Gerard Andrews, director of audio/voice IP marketing at Cadence. “By working closely with Fraunhofer throughout the development of this audio codec, we are able to offer a highly optimized, ultra-low power implementation on the HiFi architecture in concert with the announcement of LE Audio. This is an example of how we’re continuing to enhance our best-in-class HiFi technology to deliver performance excellence for our customers’ audio and voice implementations.”

Tensilica HiFi DSPs are the most widely licensed audio/voice/AI speech processors. Part of the broad Cadence IP portfolio, they enable SoC design excellence in support of Cadence’s Intelligent System Design strategy. For more information on the Tensilica HiFi DSP family, visit http://ip.cadence.com/ipportfolio/tensilica-ip/audio.

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence’s software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s Intelligent System Design strategy helps customers develop differentiated products—from chips to boards to intelligent systems—in mobile, consumer, cloud, data center, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine‘s 100 Best Companies to Work For. Learn more at cadence.com.

© 2020 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo and the other Cadence marks found at www.cadence.com/go/trademarks are trademarks or registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective holders.



Contact:

Cadence Newsroom
408-944-7039
newsroom@cadence.com

Featured Video
Jobs
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise