3 September 2019 – Ventec International Group Co., Ltd. (6672 TT), a world leader in the production of polyimide & high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, will be showcasing its latest high reliability PCB materials at two key industry trade shows in the US this month. The Ventec US-team will be in Santa Clara (CA) at PCB West on 10 September (Booth #508) and our thermal management & IMS-specialists will be at the Electric & Hybrid Vehicle Technology Expo in Novi (MI) on booth #1351 from 10-12 September.

PCB West, Santa Clara (CA)

Ventec will once again be exhibiting at one of the industry’s most important exhibitions for printed circuit board design, fabrication and assembly in the US. The Ventec US-team will be on booth #508 to present the company’s unique laminate & prepreg capability across a very wide range of applications and budgets - all supported by a fast and efficient global delivery promise through Ventec's fully controlled and managed global supply chain and world-class dependable technical support. A key focus will be Ventec’s extended ceramic-filled hydrocarbon thermoset material series tec-speed 20.0. The range combines unrivaled high-frequency performance (Dk 3.00-3.48 / Df 0.002-0.0037), superior loss characteristics and highest reliability particularly demanded by 5G applications. The extended tec speed 20.0 range is designed for the world's most demanding high frequency Printed Circuit Board applications and is already proving to be very popular with customers requiring high-performance, reliable and cost-efficient high frequency materials.

Electric & Hybrid Vehicle Technology Expo, Novi (MI)

From 10-12 September, visitors are invited to meet our thermal management & IMS specialists on booth #1351 to discover the latest advances in high performance IMS materials and thermally conductive prepregs & thin core laminates that deliver exceptional thermal performance, reliability and quality.

With the rise in new energy vehicles, automotive manufacturers around the world are already showing a keen interest and relying on Ventec's advanced range of high thermal conductivity-, low-loss-, heavy copper- and black laminates, including:

• VT-4B5 SP, an aluminum base laminate that ensures maximum thermal efficiency for direct-to-metal connections of electrically isolated heat sources and places dielectric insulation only where needed;
• VT-4B5L, a high performance IMS material that offers excellent solder joint reliability and thermal conductivity of 4.0 W/mK.;
• VT-4B5H, a metal base laminate material with high Tg (180oC) and thermal conductivity of 4.2 W/mK., ideally suited for applications such as LED lighting, power conversion, monitor drives and power supply;
• VT-4B7, a high performance IMS Material for applications where maximum thermal conductivity and electrical performance are key. Specified at 7.0 W/mK., VT-4B7 is an affordably priced substrate that competes strongly with direct-bond copper (DBC).

For more information about Ventec's solutions and the company’s wide variety of products, please visit www.venteclaminates.com.

About Ventec International Group

Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.

For more information, visit www.venteclaminates.com.

Safe Harbor Statement

This press release contains projections and other forward-looking statements regarding future events or our future financial performance. All statements other than present and historical facts and conditions contained in this release, including any statements regarding our future results of operations and financial positions, business strategy, plans and our objectives for future operations, are forward-looking statements. These statements are only predictions and reflect our current beliefs and expectations with respect to future events and are based on assumptions and subject to risk and uncertainties and subject to change at any time. We operate in a very competitive and rapidly changing environment. New risks emerge from time to time. Given these risks and uncertainties, you should not place undue reliance on these forward-looking statements. Actual events or results may differ materially from those contained in the projections or forward-looking statements. Some of the factors that could cause actual results to differ materially from the forward-looking statements contained herein include, without limitation: (i) the contraction or lack of growth of markets in which we compete and in which our products are sold (ii) unexpected increases in our expenses, including manufacturing expenses, (iii) our inability to adjust spending quickly enough to offset any unexpected revenue shortfall, (iv) delays or cancellations in spending by our customers, (v) unexpected average selling price reductions, (vi) the significant fluctuation to which our quarterly revenue and operating results are subject, (vii) our inability to anticipate the future market demands and future needs of our customers, (viii) our inability to achieve new customer wins or for customer wins to result in shipments of our products at levels and in the timeframes we currently expect, (ix) our inability to execute on strategic alliances, (x) the impact of natural disasters on our sourcing operations and supply chain, and(xi) other factors detailed in documents we file from time to time with the Securities and Exchange Commission.



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Ventec International Group
Kim Sauer (Mr)
Global Marketing Communications
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