Arteris® IP FlexNoC® Interconnect & Resilience Package Licensed by Vayyar Imaging for ISO 26262-Compliant 3D Imaging Chips for Automotive Systems

NoC interconnect enables high bandwidth and low latency on-chip communications while increasing functional safety diagnostic coverage

CAMPBELL, Calif., Mar. 19, 2019 — (PRNewswire) —

CAMPBELL, Calif., Mar. 19, 2019 /PRNewswire-PRWeb/ -- Arteris IP, the leading supplier of innovative, silicon-proven network-on-chip (NoC) interconnect intellectual property, today announced that Vayyar Imaging has licensed Arteris FlexNoC interconnect IP and the accompanying FlexNoC Resilience Package for use in its next-generation radio frequency (RF) 3D imaging chips for automotive systems.

Vayyar creates powerful and unique chips that perform high-resolution 3D imaging in real time using advanced RF technology. The company's current generation of chips covers multiple radar bands from 3 to 81 GHz and implements 72 transmitters and 72 receivers along with an integral advanced digital signal processor (DSP). Use of the Arteris FlexNoC interconnect IP and Resilience Package will enable the integration of even more processing units while providing in-hardware data protection for automotive functional safety.

"Vayyar's chip is the most advanced radar imaging SoC in the market today enabling real-time high-resolution 3D Point Cloud. Our chip requires the ability to transfer large amounts of data and make sure the highest safety standards are kept. Arteris NoC technology enables data protection mechanisms that increase the functional safety of our systems to meet the highest automotive safety standards," said Raviv Melamed, CEO and Co-Founder of Vayyar.

"We are excited that Vayyar, the industry leader in RF 3D imaging technology, has adopted Arteris IP interconnect technology as the communications backbone of their ISO 26262-compliant 3D radar imaging chips," said K. Charles Janac, President and CEO of Arteris IP. "Vayyar's choice is confirmation of our technology's ability to optimize high bandwidth and low latency on-chip communications while increasing system-wide functional safety diagnostic coverage."

About Vayyar Imaging
Vayyar Imaging is the global leader for imaging and sensing applications with its cutting-edge 3D imaging sensor technology. Vayyar's sensors quickly and easily look into objects or any defined volume and detect even the slightest anomalies and movements to bring highly sophisticated imaging capabilities to many industries. Utilizing a state-of-the-art embedded chip and advanced imaging algorithms, Vayyar's mission is to help people worldwide improve their health, safety and quality of life using mobile, low-cost, and safe 3D imaging sensors. Visit http://www.vayyar.com to learn more.

About Arteris IP
Arteris IP provides network-on-chip (NoC) interconnect IP to accelerate system-on-chip (SoC) semiconductor assembly for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Baidu, Mobileye, Samsung, Huawei / HiSilicon, Toshiba and NXP. Arteris IP products include the Ncore cache coherent and FlexNoC non-coherent interconnect IP, the CodaCache standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit http://www.arteris.com or find us on LinkedIn at https://www.linkedin.com/company/arteris.

Arteris, FlexNoC, Ncore, and PIANO are registered trademarks of Arteris, Inc. Arteris IP, CodaCache, and the Arteris IP logo are trademarks of Arteris, Inc. All other product or service names are the property of their respective owners.
###

 

SOURCE Arteris IP

Contact:
Company Name: Arteris IP
Web: http://www.arteris.com

Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Equipment Engineer, Raxium for Google at Fremont, California
GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise