OCP 2019: eSilicon to demonstrate 56G DSP SerDes over a 5-meter cable assembly in Samtec booth

SAN JOSE, Calif., March 12, 2019 (GLOBE NEWSWIRE) -- eSilicon, a leading provider of FinFET-class ASICs, market-specific IP platforms and advanced 2.5D packaging solutions, will demonstrate its 7nm FinFET-class SerDes IP product at OCP 2019.

What
SerDes Demonstration: Samtec booth at OCP, San Jose Convention Center
Thursday-Friday
March 14-15, 2019
Using Samtec ExaMAX Backplane Connector paddle cards and a five-meter ExaMAX Backplane Cable Assembly, eSilicon will demonstrate the performance, flexibility and extremely low power consumption of its  7nm, 56G PAM4 and NRZ DSP-based long-reach SerDes.

The demonstration will drive four high-speed SerDes lanes in three configurations:

  • CPRI NRZ modulation with point-to-point links
  • 50G Ethernet PAM4 modulation with point-to-point links
  • 56 Gbps PAM4 modulation with point-to-point links

Real-time data associated with all channels will also be displayed to demonstrate the robustness and low power of the device, including:

  • Voltage histograms, pre- and post-DSP
  • Signal-to-noise ratio (SNR)
  • Equalization
  • Eye diagrams
  • Bit error rate (BER) monitor

About OCP
March 14-15, 2019
San Jose Convention Center
San Jose, Calif., USA
The 2019 Open Compute Project (OCP) Global Summit brings together more than 3,400 key decision makers, executives, engineers, developers and suppliers. Together, they help grow, drive and support the open hardware ecosystem in, near and around the datacenter and beyond.

About e Silicon
eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Our ASIC-proven, differentiating IP includes highly configurable 7nm 56G/112G SerDes plus networking-optimized 16/14/7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialized memory compilers and I/O libraries. Our neuASIC™ platform provides AI-specific IP and a modular design methodology to create adaptable, highly efficient AI ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets. www.esilicon.com

Collaborate. Differentiate. Win.™

eSilicon is a registered trademark, and the eSilicon logo and “Collaborate. Differentiate. Win.” are trademarks, of eSilicon Corporation. Other trademarks are the property of their respective owners.

Contacts:   
Sally SlemonsNanette Collins
eSilicon CorporationPublic Relations for eSilicon
408-635-6409617-437-1822
Email Contact Email Contact

eSilicon.jpg

Featured Video
Latest Blog Posts
Sanjay GangalAECCafe Today
by Sanjay Gangal
AEC Industry Predictions for 2025 — vGIS
Sanjay GangalIndustry Predictions
by Sanjay Gangal
AEC Industry Predictions for 2025 — QeCAD
Jobs
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Consumer Electronics Show 2025 - CES 2025 at Las Vegas Convention Center Las Vegas NV - Jan 7 - 10, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Geospatial World Forum 2025 at Madrid Marriott Auditorium Madrid Spain - Apr 22 - 25, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise