SAN JOSE, Calif. — (BUSINESS WIRE) — February 26, 2019 — Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced that it will begin sampling new JEDEC e-MMC[1] Ver. 5.1[2] compliant embedded flash memory products for consumer applications next month. The new products integrate the company’s BiCS FLASH™ 3D flash memory and a controller in a single package.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190226005459/en/
New e-MMC products from Toshiba Memory America integrate the company's BiCS FLASH 3D flash memory and a controller in a single package. (Photo: Business Wire)
The company will continue to reinforce its market-leading position by delivering a broad, high-performance product lineup, including for applications that continue to need e-MMC as an embedded memory solution.
“e-MMC remains an important solution for many applications,” noted Scott Beekman, director of managed flash memory products for Toshiba Memory America, Inc. “Our e-MMC products with BiCS FLASH 3D flash memory will enable these applications to continue to have access to the latest flash technology.”
Key Specifications
| Interface |
JEDEC e-MMC V5.1 standard
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| Density[3] | 16GB, 32GB, 64GB, 128GB | ||
| Power Supply Voltage |
2.7V to 3.6V (Memory core)
1.7V to 1.95V (Interface) |
||
| Bus Width | ×1 / ×4 / ×8 | ||
| Temperature Range | -25℃ to +85℃ | ||
| Package |
153Ball FBGA
11.5mm × 13.0mm |
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New Product Lineup
|
Product Name |
Capacity [3] | Package | Mass Production | ||||||
| THGAMRG7T13BAIL | 16GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | ||||||
| THGAMRG8T13BAIL | 32GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | ||||||
| THGAMRG9T23BAIL | 64GB | 11.5×13.0×0.8mm | 3Q, 2019 (Jul.-Sep.) | ||||||
| THGAMRT0T43BAIR | 128GB | 11.5×13.0×1.0mm | 3Q, 2019 (Jul.-Sep.) | ||||||
