- STMicroelectronics STM32MP1 microprocessor
- STPMIC1 Power Management IC (PMIC)
- Up to 1GB of DDR3 memory
- 4K non-volatile EEPROM
- MEMs oscillators
- Over 100 passives
- All into a single BGA package
The new STM32MP1 contains Dual Arm® Cortex®-A7 microprocessors along with an Arm® Cortex®-M4 microcontroller. It has a wide range of peripherals spanning from two 22 Channel ADCs, to a camera interface, to 1Gbps ethernet, to a 3D GPU, making it a great fit for remote sensors, HMI displays, motor control applications, medical systems, and IoT end points. The integration provided by the OSD32MP1 SiP makes the solution ideal for any application needing a versatile applications processor in a small package.
The OSD32MP1 Simplifies Migrating from a Microcontroller to Linux
The STM32MP1 builds on the success of the STM32 line of microcontrollers by leveraging the STM32 Cube Environment. The inclusion of the M4 allows full reuse of the STM32 MCU Cube Firmware while adding support for Linux. The OSD32MP1 integration allows users to take advantage of a full microprocessor without the increase in complexity that typically comes from routing DDR and complex power management. The ability to reuse firmware and the elimination of complexity makes the OSD32MP1 the easiest path for designers to move from a microcontroller to Linux.
"The continued push of IoT and the demand for more data has required many applications to migrate from an existing microcontroller design to one based on a microprocessor running Linux. There are usually two major hurdles that prevent this from being an easy transition; porting their application, and complicated hardware designs," comments Greg Sheridan, Marketing Manager at Octavo Systems. "Integrating the new STM32MP1 into the OSD32MP1 removes these roadblocks, greatly reducing the effort required to migrate from a microcontroller to a microprocessor running Linux."
Beyond simplifying the design process, the OSD32MP1 brings all the other benefits of System-in-Package to this new set of designs. These benefits include lower cost Printed Circuit Boards (PCBs) by requiring less space and needing less complicated manufacturing processes, like Laser Vias or Via-in-Pad. The OSD32MP1 also simplifies the task of sourcing components by integrating over 100 devices from multiple vendors into a single component.
"Having ST ask us to be one of their partners at launch really validates our vision for the future of electronics design. Designers will demand more integrated solutions to start to develop their unique applications faster rather than spend time on tedious tasks that don't differentiate their product," adds Gene Frantz, CTO Octavo Systems. "System-in-Package is the solution to provide this tremendous level of integration."
Availability and Pricing
Design resources for the OSD32MP1 are available today on the Octavo Systems website. Samples will be available in Q3 with full production scheduled for Q4. "Pricing is still being finalized and will be in-line with the cost of an equivalent system designed with discrete components," said Greg.
About Octavo Systems:
Octavo Systems builds highly integrated system building blocks utilizing System-in-Package (SiP) technology. This integration removes complex and tedious tasks from the electronics design process enabling more people to take advantage of this technology.
Media Contact:
Greg Sheridan
512-861-3400x155
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SOURCE Octavo Systems
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