TE's featured live demos in its booth will include:
- OSFP, QSFP-DD, QSFP, SFP-DD, high-speed I/O and STRADA Whisper, showcasing solutions for 5G, disaggregation, density, improved channels, thermal management, co-packaging and power delivery.
- The Sliver Interconnect Family, which has not only received industry recognition, but has been identified as the standard interface and required product performance through several industry groups like COBO, GenZ, EDSFF and Open Compute for current and next-gen server, storage and networking designs.
"Speed, density and high efficiency are all key requirements for new data center designs," said Erin Byrne, vice president and chief technology officer for TE Connectivity's Data and Devices business unit. "At DesignCon, TE will showcase solid engineering of industry-standard interfaces with innovative thermal and power management solutions, meeting the challenges of increasing density and speed in the data center."
Learn more on TE's DesignCon 2019 events page.
ABOUT TE CONNECTIVITY
TE Connectivity Ltd. is a $14 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at
www.te.com and on LinkedIn, Facebook, WeChat and Twitter.
TE Connectivity, TE, TE connectivity logo, and EVERY CONNECTION COUNTS are trademarks of the TE Connectivity Ltd. family of companies. Other logos, product(s) and/or company names might be trademarks of their respective owners.
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| Contact: |
| Company Name: TE Connectivity, DesignCon 2019
Lauren Brekosky, TE Connectivity, 717-986-7342 Email Contact Web: http://www.te.com |
