Pickering to showcase world’s smallest footprint Reed Relay at productronica 2017

November 13, 2017 -- Pickering Electronics, a long-established Reed Relay manufacturer, will showcase the world’s highest density Reed Relay at productronica 2017, on booth A1.452.

Pickering’s new Series 120 4mm2 TM reed relay range ( Figure 1) has attracted a lot of interest since being released in July at Semicon West in San Francisco. The relays require a board area of only 4mm x 4mm, making it the highest packing density currently available, taking up the smallest board area ever.

Two switch types will be available, a general purpose sputtered ruthenium switch rated at 15 Watts, 1 Amp (3 Volt version) or 20 Watts, 1 Amp (5 & 12 Volt versions) and a low level sputtered ruthenium switch rated at 10 Watts, 0.5 Amps.

Figure 1Pickering’s new Series 120 4mm2 TM reed relay range

These are the same reed switches as used in many other long-established Pickering Electronics ranges but are orientated vertically within the package, allowing this very high density. The small size of the package does not allow an internal diode. Back EMF suppression diodes are included in many relay drivers but if they are not, and depending on your drive methods, these may have to be provided externally.

Figure 2: A total of 528 Series 120 relays on
Pickering Interfaces ultra-high-density PXI module
illustrates the packing density of these
extremely small Reed Relays.

The relays feature an internal mu-metal magnetic screen. Mu-metal has the advantage of a high permeability and low magnetic remanence and eliminates problems that would otherwise occur due to magnetic interaction. Relays of this small size without magnetic screening would be totally unsuitable for applications where dense packing is required.

To learn more about this industry changing Reed Relay visit Pickering Electronics in booth A1.452 at productronica 2017 in November 14 – 17 2017.  www.pickeringrelay.com

Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Equipment Engineer, Raxium for Google at Fremont, California
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise