STMicroelectronics Cooperating with MediaTek to Integrate Industry-Leading NFC Technology into Mobile-Platform Designs

 

ST MediaTek NFC_IMAGE.jpg
ST MediaTek NFC_IMAGE


  • Collaboration delivers complete mobile payment platform
  • Independent solutions provide secure sourcing for OEMs and include an NFC controller with an optional embedded Secure Element

 

Geneva, September 5, 2017 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced the integration of its contactless NFC technology with MediaTek's mobile platforms. This creates a complete solution for handset developers to design next-generation smartphones capable of supporting tightly integrated NFC mobile services.

Mobile payments are expected to see triple-digit growth in the coming years[1], with contactless transport ticketing also rising fast in Asia, notably in China's largest cities.

By integrating ST's NFC chipset with the MediaTek mobile platforms, the two partners help mobile OEMs overcome key technical challenges such as antenna design and integration, antenna miniaturization, and bill-of-material optimization while assuring interoperability with payment terminals in locations like retailers and transportation hubs.

MediaTek is the world's second-largest supplier of mobile-handset solutions, and with the addition of ST's technology can demonstrate high contactless performance relative to alternative platforms.

"ST will provide its NFC technology to MediaTek, to deliver high contactless performance solutions to OEMs with a focus on cost and integration optimization through smaller antennas and reduced bill of materials," said Marie-France Florentin, Group Vice President, General Manager, Secure Microcontroller Division, STMicroelectronics. "While ST has for years been providing to customers its own robust NFC and RFID technology, the ST21NFCD is the first device from ST to integrate the market-proven booster technology ST recently acquired."

 

About ST's Mobile-Transaction (NFC) Technology:

Mobile payments and other contactless applications are primarily enabled by Near-Field Communication (NFC) technology, as found in contactless-payment cards and payment terminals. ST's NFC chipset, or System-in-Package, solves the challenges of achieving a robust wireless connection over extended communication distances to make mobile payments easy, dependable, and private, while protecting against cybersecurity threats including eavesdropping and hacking.

ST's latest NFC Systems-in-Package ST54F and ST54H comprise the ST21NFCD NFC controller with active load modulation for extended range with ST33G1M2 and ST33J2M0 embedded secure element (eSE), and operating system.

More information is available on ST.com.

 

About STMicroelectronics

ST is a global semiconductor leader delivering intelligent and energy-efficient products and solutions that power the electronics at the heart of everyday life. ST's products are found everywhere today, and together with our customers, we are enabling smarter driving and smarter factories, cities and homes, along with the next generation of mobile and Internet of Things devices.

By getting more from technology to get more from life, ST stands for life.augmented.

In 2016, the Company's net revenues were $6.97 billion, serving more than 100,000 customers worldwide. Further information can be found at www.st.com.

 

For Press Information Contact:

STMicroelectronics
Michael Markowitz
Director of Technical Media Relations
+1 781 591 0354
michael.markowitz@st.com


[1] The "Mobile Payments Report," Business Intelligence, June 2016


Attachments:

http://www.globenewswire.com/NewsRoom/AttachmentNg/d56b5056-abc3-43b8-8e13-0e24d5d7c05c

Attachments:

A photo accompanying this announcement is available at http://www.globenewswire.com/NewsRoom/AttachmentNg/eaf95f51-261b-4f04-8385-047717b7c657

Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise