Mercury Systems Introduces First Low-Profile High-Density Secure Memory Device for Defense and Commercial Avionics Markets

ANDOVER, Mass., Aug. 28, 2017 (GLOBE NEWSWIRE) -- Mercury Systems, Inc. (NASDAQ:MRCY) ( www.mrcy.com) announced volume production of the most recent addition to its portfolio of high-density secure memory devices. Optimized for significantly space-constrained defense and commercial avionics applications, Mercury’s new product embeds 2GB of double data rate third-generation synchronous dynamic random-access memory (DDR3 SDRAM) in a highly compact, ruggedized ball grid array (BGA) package. Incorporating the most recent advances in Mercury’s miniaturization technology, the less than 2.4mm height of this new product sets the defense industry standard for low-profile, high-density secure memory.

Modern defense and commercial avionics programs are tasked with simultaneously reducing size, weight, and power (SWaP) while rapidly analyzing multiple streams of data from a variety of sensor processing subsystems. By reducing the height of its high-density secure memory devices to less than 2.4mm, Mercury’s latest innovation allows system architects to mount high-speed, ruggedized memory on the backside of the printed circuit board instead of the front side. By replacing four discrete memory devices on the front side of a board with a single Mercury low-profile 2GB memory device mounted on the backside of the board, 441mm2 of highly valuable front-side board real estate can be made available. As a result, system architects can now add additional active and passive components needed for enhanced system functionality required for a successful mission.

“Today’s announcement of the low-profile 2GB DDR3 high-density secure memory device further reinforces Mercury’s leadership position delivering commercial innovations that address the most challenging problems in the defense and commercial avionics industries today,” says Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our Advanced Microelectronics Center is uniquely positioned to support our warfighters with state-of-the-art, highly ruggedized microelectronics solutions needed for today’s most advanced avionics applications.”

In addition to uncompromising performance in SWaP-optimized form factors, Mercury integrates trust and supply chain security throughout the complete lifecycle of its high-density secure memory product portfolio. All high-density secure memory products are manufactured exclusively in the Company’s Defense Microelectronics Activity (DMEA)-trusted facility, which has received accreditation for design, broker, packaging, assembly, and test services. Several of Mercury’s facilities have also received a Superior rating from the Defense Security Service (DSS). Furthermore, Mercury protects its electronic records with an active cybersecurity program modeled after the Center for Internet Security (CIS) critical security controls.

Mercury’s application engineering team routinely assists customers integrating high-density secure memory into new or existing designs. For application assistance, additional product information, or purchase inquiries, customers can visit www.mrcy.com/DDR3 or contact Mercury at (866) 627-6951 or secure.memory@mrcy.com.

Mercury Systems – Innovation That Matters
Mercury Systems (NASDAQ:MRCY) is a leading commercial provider of secure sensor and mission processing subsystems. Optimized for customer and mission success, Mercury’s solutions power a wide variety of critical defense and intelligence programs. Headquartered in Andover, Mass., Mercury is pioneering a next-generation defense electronics business model specifically designed to meet the industry’s current and emerging technology needs. To learn more, visit www.mrcy.com.

Forward-Looking Safe Harbor Statement
This press release contains certain forward-looking statements, as that term is defined in the Private Securities Litigation Reform Act of 1995, including those relating to the products and services described herein. You can identify these statements by the use of the words “may,” “will,” “could,” “should,” “would,” “plans,” “expects,” “anticipates,” “continue,” “estimate,” “project,” “intend,” “likely,” “forecast,” “probable,” “potential,” and similar expressions. These forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. Such risks and uncertainties include, but are not limited to, continued funding of defense programs, the timing and amounts of such funding, general economic and business conditions, including unforeseen weakness in the Company’s markets, effects of continued geopolitical unrest and regional conflicts, competition, changes in technology and methods of marketing, delays in completing engineering and manufacturing programs, changes in customer order patterns, changes in product mix, continued success in technological advances and delivering technological innovations, changes in, or in the U.S. Government’s interpretation of, federal export control or procurement rules and regulations, market acceptance of the Company's products, shortages in components, production delays or unanticipated expenses due to performance quality issues with outsourced components, inability to fully realize the expected benefits from acquisitions and restructurings, or delays in realizing such benefits, challenges in integrating acquired businesses and achieving anticipated synergies, increases in interest rates, changes to export regulations, increases in tax rates, changes to generally accepted accounting principles, difficulties in retaining key employees and customers, unanticipated costs under fixed-price service and system integration engagements, and various other factors beyond our control. These risks and uncertainties also include such additional risk factors as are discussed in the Company's filings with the U.S. Securities and Exchange Commission, including its Annual Report on Form 10-K for the fiscal year ended June 30, 2017. The Company cautions readers not to place undue reliance upon any such forward-looking statements, which speak only as of the date made. The Company undertakes no obligation to update any forward-looking statement to reflect events or circumstances after the date on which such statement is made.

Mercury Systems and Innovation That Matters are trademarks of Mercury Systems, Inc. Other product and company names mentioned may be trademarks and/or registered trademarks of their respective holders. 

Contact:
Robert McGrail, Director of Corporate and Investor Communications
Mercury Systems, Inc.
+1 978-967-1366 / rmcgrail@mrcy.com

Primary Logo

Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise