Validates new 3D metrology option on NSX Systems for bump process control

WILMINGTON, Mass. — (BUSINESS WIRE) — February 16, 2017 — Rudolph Technologies, Inc. (NYSE: RTEC) announced today that a leading memory manufacturer in Asia has placed orders totaling over $8 million USD for process control equipment to support the ramp of their latest high-performance stacked memory devices. The equipment spans front- and back-end applications. It includes MetaPULSE^® metrology systems for plating and etch control and NSX^® 330 systems for two- and three-dimensional (2D/3D) inspection and metrology throughout the back-end process. The systems are scheduled to ship in the first quarter of this year.

“Controlling the etch process is critical for high-performance memory stacks at advanced nodes,” said Mike Goodrich, vice president and general manager of Rudolph’s Process Control Group. “Rudolph’s MetaPULSE system is widely used to measure opaque materials, like metals, for critical processes at sub-20nm nodes. We are happy to see its capabilities now applied to new process steps for controlling hard mask etch and plating, which are challenged by increased memory density. With the MetaPULSE G system, our customer was able to obtain the critical on-product metrology required to achieve high device yields, while at the same time, reducing process-related costs by eliminating monitor wafers.”

Goodrich continued, “The through silicon via (TSV) and bump processes used to connect individual die in stacked memory devices are exceedingly complex and need careful monitoring and control. Our NSX system combines high-speed inspection and metrology to provide the sensitive defect detection and accurate measurements needed to help ensure TSV interconnects meet specifications. The system’s new 3D metrology capability measures the coplanarity of the micro bumps added to completed TSVs to make external connections. Coplanarity is required to ensure good connections and high yields for these high-performance devices.”

Elvino Da Silveira, Rudolph’s vice president of marketing, elaborated, “Rudolph expects to see significant growth in multi-die packages. This order illustrates the strength of our offerings in this and a range of similar processes, from 2.5D and fan-out to the TSV processes now emerging for high-performance applications in data centers and advanced computing. As the complexity of devices and packages increases, we expect the value of, and demand for, our technologies to increase as well.”

For more information about Rudolph’s systems and software, please visit www.rudolphtech.com.

About Rudolph Technologies
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor Statement
This press release contains forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995 (the “Act”) which include the benefit to customers of Rudolph’s products, Rudolph’s ability to successfully innovate, develop new technologies and products and deliver products and services consistent with our customers’ demands and expectations as well as other matters that are not purely historical data. Rudolph wishes to take advantage of the “safe harbor” provided for by the Act and cautions that actual results may differ materially from those projected as a result of various factors, including risks and uncertainties, many of which are beyond Rudolph’s control. Such factors include, but are not limited to, the company’s offered design enhancements may not necessarily translate into significant revenue and the challenges presented by the new product development and marketing. Additional information and considerations regarding the risks faced by Rudolph are available in Rudolph’s Form 10-K report for the year ended December 31, 2015 and other filings with the Securities and Exchange Commission. As the forward-looking statements are based on Rudolph’s current expectations, the company cannot guarantee any related future results, levels of activity, performance or achievements. Rudolph does not assume any obligation to update the forward-looking information contained in this press release.

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