Arteris FlexNoC Physical and FlexNoC Resilience Packages Licensed by Mobileye for Next-Generation Advanced Driver Assistance Systems (ADAS)

Long-time FlexNoC interconnect user implements hardware-based functional safety technologies for ISO 26262 qualification of autonomous vehicles

CAMPBELL, Calif. — Sep. 27, 2016 — Arteris Inc., the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect IP, today announced that Mobileye, the global pioneer and leader in camera-based Advanced Driver Assistance Systems (ADAS), has licensed Arteris FlexNoC interconnect IP, as well as  FlexNoC Physical and  FlexNoC Resilience Packagesfor use in its next-generation EyeQ5® vision-based SoC family.

Mobileye first licensed Arteris FlexNoC in 2010 for use in its EyeQ3®product line and also used FlexNoC IP in its EyeQ4® products. The experiences of the EyeQ3® development team using Arteris FlexNoC were documented in a  case study written with the participation of key Mobileyedevelopment team members.

“For years, Arteris technology has allowed us to continually increase the performance of each EyeQ ADAS SoC generation while reducing wire routing congestion and timing closure issues,” said Elchanan Rushinek, Vice President of Engineering, at Mobileye. “The data protection technologies in the FlexNoC Resilience Package allow us to more easily implement state-of-the-art functional safety features in hardware, which simplifies the tasks of our software development teams as we strive to meet the most stringent ISO 26262 requirements. And the automation features in FlexNoC Physical promise to reduce the amount of effort and time required for us to achieve SoC timing closure.”

The  FlexNoC Resilience Package complements the FlexNoC fabric IP and implements hardware reliability and functional safety features required for automotive ISO 26262 compliance. Specific technologies relevant to automotive functional safety include error-correcting code (ECC) protection of on-chip communications, hardware duplication of interconnect components, fault safety controllers, and built in self-test (BIST) for resilience functions. The combined use of these safety technologies allows for the design of semiconductor hardware with higher diagnostic coverage metrics than was previously possible, making it easier for design teams to meet the highest ISO 26262 automotive safety integrity level (ASIL D) requirements required for autonomous driving.

To accelerate the interconnect timing closure process, Mobileye has also licensed multiple  Arteris FlexNoC Physical packages, which enable automated interconnect timing closure of complex SoCs thereby improving interconnect area, latency and power consumption while reducing SoC schedule risk. A majority of SoC timing closure issues are usually uncovered late in the design schedule and are the result of long interconnect paths stretching across the SoC. Manually closing the timing for these issues used to take months and has often led to additional timing closure issues during the layout phase of a project, where schedules are typically compressed due to multiple place and route (P&R) runs. Verifying the NoC interconnect IP from a physical point of view during the architectural and RTL development phases, prior to full SoC P&R, reduces the likelihood of timing closure issues during layout. The FlexNoC Physical package includes floorplan input and output management, automatic pipeline insertion, and integration with Synopsys and Cadence place and route tools.

“We are honored that Mobileye continues to deploy Arteris interconnect technology as the communications backbone for their newest family of EyeQ5® vision ADAS SoCs,” said K. Charles Janac, President and CEO of Arteris. “Mobileye’s choices are proof of our ability to help designers of highly complex systems meet the strictest ISO 26262 functional safety requirements while helping remove back-end SoC timing closure from the list of development schedule risks.”

About Mobileye

Mobileye N.V. is the global leader in the development of computer vision and machine learning, data analysis, localization and mapping for Advanced Driver Assistance Systems and autonomous driving. The Company’s technology keeps passengers safer on the roads, reduces the risks of traffic accidents, saves lives and has the potential to revolutionize the driving experience by enabling autonomous driving. The Company’s proprietary software algorithms and EyeQ® chips perform detailed interpretations of the visual field in order to anticipate possible collisions with other vehicles, pedestrians, cyclists, animals, debris and other obstacles. The Company’s products are also able to detect roadway markings such as lanes, road boundaries, barriers and similar items; identify and read traffic signs, directional signs and traffic lights; create a Roadbook™ of localized drivable paths and visual landmarks using REM™; and provide mapping for autonomous driving. The Company’s products are or will be integrated into car models from 25 global automakers. The Company’s products are also available in the aftermarket.

About Arteris

Arteris, Inc. provides  system-on-chip (SoC) interconnect IP and tools to accelerate SoC semiconductor assembly for a wide range of applications. Rapid semiconductor designer adoption by customers such as  SamsungHuawei / HisiliconMobileyeAltera, and  Texas Instruments has resulted in Arteris being the only semiconductor IP company to be ranked in the Inc. 500 and Deloitte Technology Fast 500 lists in 2012 and 2013. Customer results obtained by using the Arteris product line include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. More information can be found at www.arteris.com.



Contact:

Kurt Shuler
Arteris Inc.
+1 408 470 7300
Email Contact

Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Business Technology Analyst for Surface Water Management at Everett, Washington
Upcoming Events
World Architecture Festival 2024 at Marina Bay Sands Singapore - Nov 6 - 8, 2024
Dimensions User Conference 2024 at The Venetian Resort Las Vegas NV - Nov 11 - 13, 2024
Greenbuild 2024 at Pennsylvania Convention Center Philadelphia PA - Nov 12 - 15, 2024
Digital Construction North (DCN) 2024 at Manchester Central. Manchester United Kingdom - Nov 13, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise