SK hynix, Inc., Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems Announce "Start your HBM/2.5D Design Today” Seminar

Seminar will present a complete HBM supply chain solution 

San Jose, California — February 4, 2016 — SK hynix, Inc. (“SK hynix”), Amkor Technology, Inc., eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. Many companies are already using HBM to create very high-bandwidth, low-power products. This seminar will present a complete HBM supply chain that is delivering and supporting customer HBM designs now.

The seminar will be held on Wednesday, March 9, 2016 at the Computer History Museum in Mountain View, California. The event will begin at 4PM Pacific time and conclude with a wine and beer reception that will include interactive demonstrations from 6PM to 7PM.

“HBM is scaling the DRAM technology to a new level where high performance, low power and small form factor are all delivered with one solution. SK hynix is excited to be in the vanguard of developing the HBM technology and accelerating HBM adoption,” said Kevin Tran, Senior Manager of Technical Marketing at SK hynix America Inc., an US subsidiary of SK hynix.

According to Ron Huemoeller, Amkor Technology, Inc.’s corporate vice president of R&D, “Amkor Technology has worked closely with our customers to implement HBM into their high-performance computing products from the early stages of development through final product launch, as part of our overall 2.5D through-silicon via (TSV) platform. This has allowed us to both have significant impact on determining the supply chain process flow, as well as provide the necessary critical services of MEOL interposer processing and SoC + HBM + interposer assembly and test. We look forward to sharing our expertise in these key areas to help promote a wider adoption of HBM into more products going forward.”

“eSilicon is currently supporting several HBM customers using its HBM PHY and advanced ASIC design and packaging capabilities,” said Mike Gianfagna, eSilicon’s vice president of marketing. “I’m delighted that 2.5D in the form of HBM is really here now. We are proud to present this work alongside our supply chain partners.”

“Northwest Logic’s highly configurable HBM Controller is being used in a wide range of high-performance HBM applications. This seminar provides a great opportunity to quickly get up to speed on HBM and learn how it can be used to create highly differentiated end-market products,” said Brian Daellenbach, president of Northwest Logic.

“Avery provides HBM memory models that enable HBM-based SoC and PHY designs to be robustly verified and performance-optimized quickly and effectively,” said Chris Browy, vice president of sales and marketing for Avery Design.

Seminar registration is now open and may be accessed at http://bit.ly/1VNjpiH.

 

About SK hynix, Inc.
SK hynix, Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips ("NAND Flash") and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com.

 

About Amkor Technology, Inc.

Amkor Technology, Inc. is a leading provider of semiconductor packaging, assembly and test services to the world’s leading semiconductor companies and electronics OEMs. Amkor’s operational base encompasses more than 7 million square feet of floor space with production facilities, product development centers and sales & support offices located in Asia, Europe and the US. For more information visit www.amkor.com

 

About e Silicon
eSilicon guides customers through a fast, accurate, transparent, low-risk ASIC journey, from concept to volume production. Explore your options online with eSilicon STAR tools, engage with eSilicon experts, and take advantage of eSilicon semiconductor design, custom IP and IC manufacturing solutions through a flexible engagement model. eSilicon serves a wide variety of markets including the communications, computer, consumer, industrial products and medical segments. Get the data, decision-making power and technology you need for first-time-right results. www.esilicon.com

The right chip. Right now™

About Northwest Logic

Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance  PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers),  Memory Interface Solution (DDR4/3/2, LPDDR4/3/2 SDRAM; HBM, MRAM, RLDRAM 3/II), and  MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit  www.nwlogic.com or Email Contact.

 

About Avery Design Systems

Founded in 1999, Avery Design Systems, Inc. enables system and SOC design teams to achieve dramatic functional verification productivity improvements through the use of formal analysis applications for RT-level and gate-level X verification; robust core-through-chip-level Verification IP for PCI Express, USB, AMBA, UFS, MIPI, DDR/LPDDR, HBM, HMC, ONFI/Toggle, NVM Express, SCSI Express, SATA Express, eMMC, SD/SDIO, and CAN FD standards. The company is a member of the Mentor Graphics Value Added Partnership (VAP) program and has established numerous Avery Design VIP partner program affiliations with leading IP suppliers. More information about the company may be found at www.avery-design.com.

Contacts:

Kevin Tran

Debi Polo

Sally Slemons

SK hynix America Inc.

Amkor Technology, Inc.

eSilicon Corporation

408-232-8386

480-786-7653

408-635-6409

Email Contact

Email Contact

Email Contact

 

 

 

Brian Daellenbach

 

Chris Browy

Northwest Logic

 

Avery Design Systems

503-533-5800 x309

 

978-851-3627

Email Contact

 

Email Contact

 

 

 

 

 

 

 

 

                                                        

                 

 

 

 

 



Read the complete story ...
Featured Video
Jobs
Principal Engineer for Autodesk at San Francisco, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Engineer 2 for Lam Research at Fremont, California
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Upcoming Events
Digital Twins 2024 at the Gaylord National Resort & Convention Center in, MD. National Harbor MD - Dec 9 - 11, 2024
Commercial UAV Expo 2025 at RAI Amsterdam Amsterdam Netherlands - Apr 8 - 11, 2025
Commercial UAV Expo 2025 at Amsterdam Netherlands - Apr 8 - 10, 2025
BI2025 - 13th Annual Building Innovation Conference at Ritz-Carlton Tysons Corner McLean VA - May 19 - 21, 2025



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
TechJobsCafe - Technical Jobs and Resumes EDACafe - Electronic Design Automation GISCafe - Geographical Information Services  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise